Intel 80960HD - Manual (Page 33)

80960HA/HD/HT
Datasheet 33
Table 14. Maximum T
A
at Various Airflows in °C (PQ4 Package Only)
Airflow-ft/min (m/sec)
f
CLKIN
(MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
Core
1X Bus
Clock
T
A
with
Heatsink †
25
33
40 71
67
63 76
74
71 79
77
75 79
77
75 80
79
77 80
79
77
T
A
without
Heatsink
25
33
40 70
65
61 73
68
65 75
72
69 75
72
69 76
74
71 76
74
71
Core
2X Bus
Clock
T
A
with
Heatsink †
16
25
33
40 71
62
55
48 76
71
66
62 79
75
71
68 79
75
71
68 80
77
74
72 80
77
74
72
T
A
without
Heatsink
16
25
33
40 69
60
52
42 72
64
57
51 75
68
63
58 75
68
63
58 76
71
66
62 76
71
66
62
Core
3X Bus
Clock
T
A
with
Heatsink †
20
25 58
51 68
64 73
70 73
70 76
73 76
73
T
A
without
Heatsink
20
25 56
48 61
55 66
61 66
61 68
64 68
64
† 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 15. 80960Hx 208-Pin PQ4 Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.07)
800
(4.06)
1000
(5.07)
θ Junction-to-Case
(Case measured as
shown in
Figure 5 .)
1 1 1 1 1 1
θ
Case-to-Ambient
(No Heatsink)
12 10 8 8 7 7
θ Case-to-Ambient
(With Heatsink) 3
11 7 5 5 4 4
NOTES:
1. This table applies to 80960Hx PQ4 plugged into socket or soldered directly to board.
2.
θ
JA
=
θ
JC
+
θ
CA
3. 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
θ
JC
θ
JA