Texas Instruments MSP430 User Manual
Page 31
www.ti.com
Hardware FAQs
12. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.
Customers should erase the information memory before its first use. Main memory of packaged
devices is blank when the device is delivered from TI.
13. The device current increases by approximately 10 ?A when a device in low-power mode is
stopped [using Halt (CCE/CCS) or Esc (C-SPY)] and then the low-power mode is restored [using
Run (CCE/CCS) or Go (C-SPY)]. This behavior appears to happen on all devices except the
MSP430F12x.
14. The following ZIF sockets are used in the FET tools and target socket modules:
•
14-pin device (PW package): Enplas OTS-14-065-01
•
14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146
•
24-pin package (PW package): Enplas OTS-24(28)-0.65-02
•
28-pin device (DW package): Wells-CTI 652 D028
•
28-pin device (PW package): Enplas OTS-28-0.65-01
•
38-pin device (DA package): Yamaichi IC189-0382-037
•
40-pin device (RHA package): Enplas QFN-40B-0.5-01
•
40-pin device (RSB package): Enplas QFN-40B-0.4
•
48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001
•
48-pin device (DL package): Yamaichi IC51-0482-1163
•
64-pin device (PM package): Yamaichi IC51-0644-807
•
64-pin device (RGC package): Yamaichi QFN11T064-006
•
80-pin device (PN package): Yamaichi IC201-0804-014
•
100-pin device (PZ package): Yamaichi IC201-1004-008
Enplas:
Wells-CTI:
Yamaichi:
31
SLAU278F – May 2009 – Revised December 2010
Frequently Asked Questions and Known Issues
© 2009–2010, Texas Instruments Incorporated