Texas Instruments MSP430 User Manual
Page 51
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MSP-TS430PW28
Table B-7. MSP-TS430PW28 Bill of Materials
(1)
No. per
Pos.
Ref Des
Description
DigiKey Part No.
Comment
Board
DNP: C1, C2 , Cover holes
1
C1, C2
0
12pF, SMD0805
while soldering
2
C3
1
10uF/10V Tantal Elko B
3
C4
1
100nF, SMD0805
4
C5
0
2.2nF, SMD0805
DNP
5
D1
1
LED green SMD0603
Micro Crystal MS1V-T1K
DNP: Cover holes and
6
Q1
0
QUARZ, Crystal
32.768kHz, C(Load) =
neighboring holes while
12.5pF
soldering
DNP: Headers and
receptacles enclosed with
7
J1, J2
2
14-pin header, TH male
kit.Keep vias free of
solder.: Header:
Receptacle
DNP: headers and
receptacles enclosed with
7.1
2
14-pin header, TH female
kit.Keep vias free of
solder.: Header:
Receptacle
8
J5, IP1
1
3-Pin Connector , male
JP1, JP4,
JP5, JP6,
8a
7
3-Pin Connector , male
Jumper on Pos 1-2
JP7, JP8,
JP9
9
JP2, JP3
2
2-Pin Connector , male
with Jumper
DNP: Cover holes while
10
BOOTST
0
ML10, 10-Pin Conn. , m
RS: 482-115
soldering
11
JTAG
1
ML14, 14-Pin Conn. , m
RS: 482-121
12
R1, R7
2
330R, SMD0805
R2, R3, R5,
12
0
0R, SMD0805
DNP
R6
14
R4
1
47K, SMD0805
15
U1
1
SOP28PW socket
Enplas: OTS-28-0.65-01
(1)
PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
51
SLAU278F – May 2009 – Revised December 2010
Hardware
© 2009–2010, Texas Instruments Incorporated