Texas Instruments MSP430 - Manual (Page 88)

MSP-TS430PN80 www.ti.com
Table B-19. MSP-TS430PN80 Bill of Materials
No. per
Pos. Ref Des Description DigiKey Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
DNP: Only
1.1 C3, C4 0 47pF, SMD0805 recommendation. Check
your crystal spec.
2 C6, C7 1 10uF/10V, Tantal Size B 511-1463-2-ND
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 green LED, SMD0603 475-1056-2-ND
DNP: Headers and
receptacles enclosed with
J1, J2, J3, SAM1029-20-NDSAM1213-
6 0 25-pin header, TH kit.Keep vias free of
J4 20-ND
solder.: Header:
Receptacle
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND
8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
Place on: J6, JP2,
9 3 Jumper 15-38-1024-ND
JP1/Pos1-2
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
DNP: Keep vias free of
11 BOOTST 0 10-pin connector, male, TH
solder
Q1: Micro Crystal
DNP: Keep vias free of
12 Q1, Q2 0 Crystal MS1V-T1K 32.768kHz,
solder
C(Load) = 12.5pF
13 R3 1 560 Ω , SMD0805 541-560ATR-ND
R1, R2, R4,
DNP: R4, R6, R7, R10,
14 R6, R7, R10, 2 0 Ω , SMD0805 541-000ATR-ND
R11, R12
R11, R12
15 R5 1 47k Ω , SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC201-0804-014 Manuf.: Yamaichi
17 PCB 1 77 x 77 mm 2 layers
Adhesive e.g., 3M Bumpons Part No. Apply to corners at bottom
18 4 ~6mm width, 2mm height
Plastic feet SJ-5302 side
DNP: Enclosed with kit
19 MSP430 2 MSP430FG439IPN
supplied by TI
88 Hardware SLAU278F – May 2009 – Revised December 2010
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