B.20 msp-ts430pn80usb – Texas Instruments MSP430 User Manual

Page 91

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MSP-TS430PN80USB

Table B-20. MSP-TS430PN80A Bill of Materials

No. per

Position

Ref Des

Description

DigiKey Part No.

Comment

Board

1

C1, C2

0

12pF, SMD0805

DNP

2

C3, C4

0

47pF, SMD0805

DNP

C6, C7,

3

3

10uF/6.3V, SMD0805

DNP C10

C10, C12

C5, C11,

4

C13, C14,

5

100nF, SMD0805

311-1245-2-ND

C15

5

C8

1

2.2nF, SMD0805

6

C9

1

470nF, SMD0805

478-1403-2-ND

7

C16

1

4.7uF, SMD0805

8

C17

1

220nF, SMD0805

9

D1

1

green LED, SMD0805

P516TR-ND

SAM1029-20-ND

DNP: Headers and receptacles

J1, J2, J3,

(Header)

10

0

20-pin header, TH

enclosed with kit. Keep vias free of

J4

SAM1213-20-ND

solder:

(Receptacle)

11

J5 , J6

2

3-pin header, male, TH

JP3, JP5,

place jumpers on pins 2-3 on JP5,

JP6, JP7,

12

7

3-pin header, male, TH

SAM1035-03-ND

JP6, JP7, JP8, JP9, JP10 place

JP8, JP9,

jumpers on pins 1-2 on JP3,

JP10

JP1, JP2,

13

3

2-pin header, male, TH

SAM1035-02-ND

Place jumper on header

JP4

14

10

Jumper

15-38-1024-ND

See Pos. 12 and Pos. 13

14-pin connector, male,

15

JTAG

1

HRP14H-ND

TH

10-pin connector, male,

16

BOOTST

0

"DNP Keep vias free of solder"

TH

Micro Crystal MS3V-T1R

17

Q1

0

Crystal

32.768kHz, C(Load) =

DNP: Q1 Keep vias free of solder

12.5pF

Q2: 4MHz Buerklin:

18

Q2

0

Crystal

DNP: Q2 Keep vias free of solder

78D134

http://www.ettinger.de/Ar

Insulating

19

0

Insulating disk to Q2

t_Detail.cfm?ART_ART

disk to Q2

NUM=70.08.121

20

D3,D4

2

LL103A

Buerklin: 24S3406

21

R3, R7

2

330

Ω

, SMD0805

541-330ATR-ND

R1, R2,
R4, R6,

22

R8,

3

0 Ohm, SMD0805

541-000ATR-ND

DNP: R6, R8, R9, R10, R11,R12

R9,R10,

R11, R12

23

R5

1

47k

Ω

, SMD0805

541-47000ATR-ND

24

U1

1

Socket:IC201-0804-014

Manuf.: Yamaichi

25

PCB

1

77 x 91 mm

2 layers

Adhesive

about 6mm width, 2mm

e.g., 3M Bumpons Part

26

4

Apply to corners at bottom side

plastic feet

height

No. SJ-5302

27

MSP430

2

MSP430F5329IPN

DNP: enclosed with kit, supplied by TI

B.20 MSP-TS430PN80USB

Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.

91

SLAU278F – May 2009 – Revised December 2010

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