Texas Instruments MSP430 User Manual
Page 36
MSP-TS430PW14
www.ti.com
Table B-1. MSP-TS430PW14 Bill of Materials
No. per
Position
Ref Des
Description
DigiKey Part No.
Comment
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C7
1
10uF/10V, Tantal Size B
511-1463-2-ND
3
C3, C5
1
100nF, SMD0805
478-3351-2-ND
DNP: C3
4
C8
0
2.2nF, SMD0805
DNP
5
D1
1
green LED, SMD0603
475-1056-2-ND
DNP: Headers and receptacles
"SAM1029-07-
6
J1, J2
0
7-pin header, TH
enclosed with kit. Keep vias free of
NDSAM1213-07-ND"
solder: Header: Receptacle
J3, J5, J7,
Place jumpers on headers J5, J7, J8,
7
J8, J9, J10,
8
3-pin header, male, TH
SAM1035-03-ND
J9, J10, J11, J12; Pos 1-2
J11, J12
8
J4, J6
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
9
Jumper
15-38-1024-ND
Place on: J5, J7-J12; Pos 1-2
14-pin connector, male,
10
JTAG
1
HRP14H-ND
TH
Micro Crystal MS1V-T1K
12
Q1
0
Crystal
32.768kHz, C(Load) =
DNP: keep vias free of solder
12.5pF
13
R2, R3
2
330
Ω
, SMD0805
541-330ATR-ND
15
R5
1
47k
Ω
, SMD0805
541-47000ATR-ND
16
U1
1
Socket: OTS-14-0.65-01
Manuf.: Enplas
17
PCB
1
56 x 53 mm
2 layers
Adhesive
about 6mm width, 2mm
e.g., 3M Bumpons Part
18
4
Apply to corners at bottom side
plastic feet
height
No. SJ-5302
19
MSP430
2
MSP430F2013IPW
DNP: enclosed with kit, supplied by TI
36
Hardware
SLAU278F – May 2009 – Revised December 2010
© 2009–2010, Texas Instruments Incorporated