Texas Instruments MSP430 User Manual
Page 60
MSP-TS430QFN23x0
www.ti.com
Table B-10. MSP-TS430QFN23x0 Bill of Materials
No. per
Pos.
Ref Des
Description
DigiKey Part No.
Comment
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3
1
10uF/10V, Tantal Size B
511-1463-2-ND
3
C4
1
100nF, SMD0805
478-3351-2-ND
4
C5
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
green LED, SMD0603
475-1056-2-ND
DNP: headers and
receptacles enclosed with
J1, J2, J3,
SAM1034-10-NDSAM1212-
6
0
10-pin header, TH
kit.Keep vias free of
J4
10-ND
solder.: Header:
Receptacle
Place jumper on header
7
J5, JP1
2
3-pin header, male, TH
SAM1035-03-ND
JP1; Pos 1-2.
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
3
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
DNP: Keep vias free of
11
BOOTST
0
10-pin connector, male, TH
solder
Micro Crystal MS1V-T1K
DNP: Keep vias free of
12
Q1
0
Crystal
32.768kHz, C(Load) =
solder
12.5pF
13
R1
1
330
Ω
, SMD0805
541-330ATR-ND
14
R2, R3
0
0
Ω
, SMD0805
541-000ATR-ND
DNP
15
R4
1
47k
Ω
, SMD0805
541-47000ATR-ND
16
U1
1
Socket: QFN-40B-0.5-01
Manuf.: Enplas
17
PCB
1
79 x 66 mm
2 layers
Adhesive
e.g., 3M Bumpons Part No.
Apply to corners at bottom
18
4
~6mm width, 2mm height
Plastic feet
SJ-5302
side
DNP: enclosed with kit
19
MSP430
2
MSP430F2370IRHA
supplied by TI
60
Hardware
SLAU278F – May 2009 – Revised December 2010
© 2009–2010, Texas Instruments Incorporated