Texas Instruments MSP430 User Manual
Page 72
MSP-TS430RGZ48B
www.ti.com
Table B-14. MSP-TS430RGZ48B Bill of Materials
No. per
Position
Ref Des
Description
DigiKey Part No.
Comment
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
C6, C7,
3
3
10uF/6.3V, SMD0805
C12
C5, C11,
4
4
100nF, SMD0805
311-1245-2-ND
C13, C14
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
478-1403-2-ND
7
D1
1
green LED, SMD0805
P516TR-ND
SAM1029-12-ND
DNP: Headers and receptacles
J1, J2, J3,
(Header)
8
0
12-pin header, TH
enclosed with kit. Keep vias free of
J4
SAM1213-12-ND
solder:
(Receptacle)
9
J5
1
3-pin header, male, TH
JP3, JP5,
place jumpers on pins 2-3 on JP5,
JP6, JP7,
10
7
3-pin header, male, TH
SAM1035-03-ND
JP6, JP7, JP8, JP9, JP10 place
JP8, JP9,
jumpers on pins 1-2 on JP3,
JP10
11
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
12
9
Jumper
15-38-1024-ND
See Pos. 10and Pos. 11
14-pin connector, male,
13
JTAG
1
HRP14H-ND
TH
10-pin connector, male,
14
BOOTST
0
"DNP Keep vias free of solder"
TH
Micro Crystal MS3V-T1R
15
Q1
0
Crystal
32.768kHz, C(Load) =
DNP: Q1 Keep vias free of solder
12.5pF
Q2: 4MHz Buerklin:
16
Q2
0
Crystal
DNP: Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Ar
Insulating
17
0
Insulating disk to Q2
t_Detail.cfm?ART_ART
disk to Q2
NUM=70.08.121
18
R3, R7
2
330
Ω
, SMD0805
541-330ATR-ND
R1, R2,
R4, R6,
19
R8,
3
0 Ohm, SMD0805
541-000ATR-ND
DNP: R6, R8, R9, R10, R11,R12
R9,R10,
R11, R12
20
R5
1
47k
Ω
, SMD0805
541-47000ATR-ND
Socket:
21
U1
1
QFN11T048-
Manuf.: Yamaichi
008_A101121_RGZ48
22
PCB
1
81 x 76 mm
2 layers
Adhesive
about 6mm width, 2mm
e.g., 3M Bumpons Part
23
4
Apply to corners at bottom side
plastic feet
height
No. SJ-5302
24
MSP430
2
MSP430F5342IRGZ
DNP: enclosed with kit, supplied by TI
72
Hardware
SLAU278F – May 2009 – Revised December 2010
© 2009–2010, Texas Instruments Incorporated