Texas Instruments MSP430 User Manual
Page 66
MSP-TS430RHA40A
www.ti.com
Table B-12. MSP-TS430RHA40A Bill of Materials
No. per
Position
Ref Des
Description
DigiKey Part No.
Comment
Board
1
C1, C2
0
12pF, SMD0805
DNP: C1, C2
2
C5
0
2.2nF, SMD0805
DNP C12
3
C3, C7
2
10uF/10V, SMD0805 5
DNP C11
4
C4, C6
2
100nF, SMD0805
478-3351-2-ND
5
C9
1
470nF, SMD0805
6
D1
1
green LED, SMD0805
P516TR-ND
DNP: headers and receptacles
J1, J2, J3,
7
4
10-pin header, TH
enclosed with kit. Keep vias free of
J4
solder. : Header : Receptacle
DNP: headers and receptacles
7.1
4
10-pin header, TH
enclosed with kit. Keep vias free of
solder. : Header : Receptacle
J5, JP1,
JP4, JP5,
Place jumper on 1-2 of JP4-JP9;
8
8
3-pin header, male, TH
SAM1035-03-ND
JP6, JP7,
Place on 1-2 on JP1
JP8, JP9
9
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
10
9
Jumper
15-38-1024-ND
see Pos 8 an 9
14-pin connector, male,
11
JTAG
1
HRP14H-ND
TH
10-pin connector, male,
12
BOOTST
0
DNP. Keep vias free of solder
TH
13
U1
1
Socket: QFN-40B-0.5-01
Manuf.: Enplas
Micro Crystal MS3V-T1R
14
Q1
0
Crystal
32.768kHz, C(Load) =
DNP: Q1. Keep vias free of solder
12.5pF
15
R1,R7
2
330R SMD0805
541-330ATR-ND
R2, R3,
16
R5, R6,
2
0 Ohm, SMD0805
541-000ATR-ND
DNP:R2, R3, R5, R6
R8, R9,
17
R4
1
47k SMD0805
18
PCB
1
79 x 66 mm
2 layers
Rubber
select appropriate; e.g.,
19
4
apply to corners at bottom side
stand off
Buerklin: 20H1724
DNP: enclosed with kit. Is supplied by
20
MSP430
2
MSP430N5736IRHA
TI
66
Hardware
SLAU278F – May 2009 – Revised December 2010
© 2009–2010, Texas Instruments Incorporated