Package dimensions, Thermal characteristics and specifications – Cirrus Logic CS8420 User Manual

Page 92

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92

DS245F4

CS8420

18. PACKAGE DIMENSIONS

THERMAL CHARACTERISTICS AND SPECIFICATIONS

INCHES

MILLIMETERS

DIM

MIN

MAX

MIN

MAX

A 0.093

0.104

2.35

2.65

A1

0.004

0.012

0.10

0.30

B

0.013

0.020

0.33

0.51

C

0.009

0.013

0.23

0.32

D

0.697

0.713

17.70

18.10

E

0.291

0.299

7.40

7.60

e

0.040

0.060

1.02

1.52

H

0.394

0.419

10.00

10.65

L

0.016

0.050

0.40

1.27

Parameter

Symbol Min Typ

Max

Units

Junction to Ambient thermal impedance (28 pin SOIC)

θJA

-

65

-

°C/W

Allowable Junction Temperature

T

J

-

-

135

°C

28L SOIC (300 MIL BODY) PACKAGE DRAWING

D

H

E

b

A1

A

c

L

SEATING

PLANE

1

e

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