Ivoclar Vivadent Telio Lab - Manual (Page 38)

Characterization with cold-curing
Telio Lab materials
Telio Lab is a two-component powder/liquid system
for the cold poylmerization.
The targeted grinding and/or the reduction of the
transition areas is the prerequisite for the smooth
transition between Telio CAD and the cold-curing
Telio Lab material.
Telio CAD
Cut-back technique with Telio Lab
(cold-curing)
– Additionally/alternatively, the ground surface can be blasted with Al
2
O
3
at 1-2 bar /15-29 psi pressure.
– Thoroughly clean with the steam jet and dry with oil-free air.
– Apply Telio Lab Cold Liquid on the cleaned surface; the reaction time is min. 2 to max. 4 minutes. The
application of the Telio Lab material is started immediately after the dough time of 4 minutes.
Alternative
Use of a silicone key
If the Telio CAD framework is manually reduced by grinding, a silicone key can be fabricated before-
hand. Pour the desired amount of Telio Lab Cold Liquid into a clear mixing beaker after the cut-back
and conditioning. Add the same quantity of Telio Lab Transpa Incisal, mix with a modelling spatula,
cover it and let the material rest for approximately 2 minutes. Pour the now well-flowable Telio Lab
evenly into the silicone key. Then, place the filled silicone key on the Telio CAD restoration.
Once the resin has reached its plastic phase, it can be contoured using an instrument that has been
wetted with monomer. After that, pressure polymerization is conducted (15 minutes at 40-50 °C/
104-122 °F at 2-6 bar/29-58 psi pressure in the pressure pot e.g. Ivomat).
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