Intel NetStructure MPCBL0001 - Manual (Page 198)

198 Technical Product Specification
Order #273817
Intel NetStructure
®
MPCBL0001 High Performance Single Board Computer
Material Declaration Data Sheets
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the
threshold level of 1000 ppm, those materials/substances are listed below.
COMMENTS
4. Material mass can be estimated by multiplying concentration (ppm) by product weight.
5. The remainder of this package consists of non-reportable metals (e.g., tin, iron, etc), epoxy resin and other non-metal materials.
3. Data in parts per million (ppm) can be used to estimate content for other packages assumed to be similar.
1. The data on Level A and B materials and substances are based on analytical testing of the following package: Item Market Name
MPCBL0001F04Q. Individual unit test results may vary due to differences in production and /or sensitivities of analytical testing
methods. Data shown on this MDDS reflect part-level testing intended to validate Intel's RoHS compliance systems. Intel's certification
of RoHS compliance at the homogenous material level is based on Supplier Declarations of Conformance.
2. This data sheet is based on the product specified and other packages are assumed to be similar.
Nickel Part Finish Components 2570
Brominated Flame
Retardant
12400
Description of Use Location in Product Material Concentration
(ppm)
INTEL ACCEPTS NO DUTY TO UPDATE THIS MDDS OR TO NOTIFY USERS OF THIS MDDS OF UPDATES OR CHANGES TO
THIS MDDS. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR
OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN
THIS MDDS THAT HAS BEEN UPDATED OR CHANGED.