HP Onboard Administrator - Manual (Page 249)

Configuring the HP BladeSystem c7000 enclosure and enclosure devices 249
Mode Insight Display
name
Description
is required for setting the Dynamic Power Cap feature.
The feature is enabled with three configuration parameters:
• Dynamic Power Cap—Total enclosure average power
will not exceed Dynamic Power Cap.
• Derated Circuit Capacity—Average power on a single
circuit will not exceed Derated Circuit Capacity.
• Rated Circuit Capacity—Peak power on a single circuit
will not exceed Rated Circuit Capacity.
When configuring these parameters, the Derated Circuit
Capacity must be at least as large as the Dynamic Power
Cap and no larger than the Rated Circuit Capacity.
The Dynamic Power Cap is used to limit the enclosure power
consumption based on a cooling constraint that might be
lower than the Derated Circuit Capacity. The Derated Circuit
Capacity is used to limit the enclosure average power
consumption on a circuit. The Rated Circuit Capacity is used
to limit the enclosure peak power consumption on a circuit.
If you need to restrict an enclosure electrical load and
thermal output, an Enclosure Dynamic Power Cap is better
than a Static Power Limit. Enclosure Dynamic Power Cap
enables more blades to power on than a Static Power Limit.
For a complete list of BladeSystem server blades supported
by Enclosure Dynamic Power Capping, see the HP website
( http://www.hp.com/go/dpc ).
Static Power Limit Power Limit An optional setting to limit power. Whenever you attempt to
power on a device, the total power demands of the new
device and of the devices already on are compared against
this Static Power Limit. If the total power demands exceed the
limit, the new device is prevented from powering on.
A Static Power Limit is better when:
• You do not want caps dynamically adjusted on your
blades.
• You prefer to not power on a server blade if it cannot be
allocated full power (even if it typically consumes less).
• More than 1/4 of the blades in the enclosure do not meet
hardware or firmware requirements for the Enclosure
Dynamic Power Cap.
None
None The enclosure power usage is not managed or capped.
Understanding Power Capping, Dynamic Power Capping, and Enclosure Dynamic Power Capping
HP delivers three varieties of power management that enable users to limit the server power consumption. All
three power capping varieties work to limit your consumption to a specified Watt or Btu/hr goal. The three
technologies are Power Capping, Dynamic Power Capping, and Enclosure Dynamic Power Capping.
Power Capping
In May 2007, HP launched Power Capping technology with iLO 2 version 1.30. This firmware-based
technology limits the average power consumption of the server to a user-defined Watt or Btu/hr goal.
Because this technology runs in firmware, it cannot limit power consumption rapidly enough to ensure
protection of PDU-level circuit breakers. Power Capping does limit power consumption rapidly enough to
protect cooling infrastructure, so it is an effective solution for data centers experiencing cooling capacity