MiTAC 8050QMA - Manual (Page 88)

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80 80 50QMA 50QMA N/B Maintenance N/B Maintenance
5.1 Intel 915PM North Bridge(10)
Power and Ground
Interface Ball Name Description
Host VTT (VCCP) FSB power supply (1.05 V) - (VCCP)
VCCA_SM VCCASM is the Analog power supply for SM data buffers used for
DLL & other logic (1.5 V)
DRAM
VCCSM System memory power supply (DDR=2.5 V; DDR2=1.8 V)
VCC3G PCI Express / DMI Analog power supply (1.5 V)
VCCA_3GBG PCI Express / DMI band gap power supply (2.5 V)
PCI Express
Based
Graphics /DMI
VSSA_3GBG PCI Express / DMI band gap ground
VCCA_HPLL Power supply for the Host VCO in the host/mem/core PLL (1.5 V)
VCCA_MPLL Power supply for the mem VCO in the host/mem/core PLL (1.5 V)
VCCD_HMPL
L
Power Supply for the digital dividers in the HMPLL (1.5 V)
VCCA_3GPLL Power supply for the 3GIO PLL (1.5 V)
VCCA_DPLL
A
Display A PLL power supply (1.5 V)
PLL Analog
VCCA_DPLL
B
Display B PLL power supply (1.5 V)
High Voltage
Interfaces VCCHV Power supply for the HV buffers (2.5 V)
VCCA_CRTD
AC
Analog power supply for the DAC (2.5 V)
VSSA_CRTD
AC
Analog ground for the DAC
CRT DAC
VCC_SYNC Power supply for HSYNC/ VSYNC (2.5 V)
VCCD_LVDS Digital power supply (1.5 V)
VCCTX_LVD
S
Data/Clk Tx power supply (2.5 V)
VCCA_LVDS LVDS analog power supply (2.5 V)
LVDS
VSSALVDS LVDS analog VSS
Power and Ground (Continued)
Interface Ball Name Description
VCCA_TVBG TV DAC Band Gap Power (3.3 V)
VSSA_TVBG TV DAC Band Gap VSS
VCCD_TVDA
C
Dedicated Power Supply for TVDAC (1.5 V)
VCCDQ_TVD
AC
Power Supply for Digital Quiet TVDAC (1.5 V)
VCCA_TVDA
CA
Power Supply for TV Out Channel A (3.3 V)
VCCA_TVDA
CB
Power Supply for TV Out Channel B (3.3 V)
TVDAC
VCCA_TVDA
CC
Power Supply for TV Out Channel C (3.3 V)
Core VCC Core VCC – (1.05 V or 1.5 V)
Ground VSS Ground
Non-Critical To Function power signals:
“NCTF” (Non-Critical To Function) have been designed into the package footprint
to enhance the Solder Joint Reliability of our products by absorbing some of the
stress introduced by the Characteristic Thermal Expansion (CTE) mismatch of the
Die to package interface. It is expected that in some cases, these balls may crack
partially or completely, however, this will have no impact to our product
performance or reliability. Intel has added these balls primarily to serve as sacrificial
stress absorbers.
NOTE: Signals do not exist in Intel 915GMS.
VTT_NCTF NCTF FSB power supply (1.05 V or 1.2 V)
VCC_NCTF NTCF Core VCC – (1.05 V or 1.5 V)
VCCSM_NCT
F
NTCF System memory power supply (DDR=2.5 V; DDR2=1.8 V)
NCTF
VSS_NCTF NTCF Ground
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