Chapter 18 recommended soldering conditions – NEC switch User Manual
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User’s Manual U12978EJ3V0UD
220
CHAPTER 18 RECOMMENDED SOLDERING CONDITIONS
The
µPD789800 Subseries should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Table 18-1. Surface Mounting Type Soldering Conditions
µµµµPD789800GB-ЧЧЧ
ЧЧЧ
ЧЧЧ
ЧЧЧ-8ES: 44-pin plastic LQFP (10 ЧЧЧЧ 10)
µµµµPD78F9801GB-8ES:
44-pin plastic LQFP (10
ЧЧЧЧ 10)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less
IR35-00-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200 °C or higher),
Count: Twice or less
VP15-00-2
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
WS60-00-1
Partial heating method
Pin temperature: 300°C max. Time: 3 seconds max. (per pin row)
−
Caution
Do not use different soldering methods together (except for partial heating).