IEI Integration WAFER-945GSE2 v1.03 - Manual (Page 44)

WAFER-945GSE2 User Manual
Page 27
A heat sink must be installed on the CPU, Northbridge and the front-side onboard memory.
Thermal paste must be smeared on the lower side of the heat sink before it is mounted on
the CPU. A heat sink is also mounted on the Southbridge chipset to ensure the operating
temperature of the chip remains low.
2.7.3 Power Consumption
7
Table 2-1 shows the power consumption parameters for the WAFER-945GSE2 running
with a 1.6 GHz Intel® Atom™ with 1.0 GB DDR2 memory.
Voltage Current
+5V 3.1A
Table 2-1: Power Consumption