INFICON SID-142 Thin Film Deposition Controller - Manual (Page 4)

Table of Contents
Chapter 1 Introduction
1.0 SID-142 Introduction...................................................................................1-1
1.1 SRC Series Computer ................................................................................1-1
1.2 SQM-142 Deposition Control Card ..............................................................1-2
1.3 SQS-142 CoDeposition Control Software.....................................................1-2
1.4 Digital I/O ..................................................................................................1-3
Chapter 2 Quick Start
2.0 Introduction................................................................................................2-1
2.1 Installation.................................................................................................2-1
2.2 Front Panel................................................................................................2-2
2.3 Program Startup ........................................................................................2-3
2.4 Single Layer Process Setup........................................................................2-4
2.5 Single Layer Process Simulation .................................................................2-8
2.6 SoftKey Functions ......................................................................................2-10
2.7 Multi-Layer CoDeposition Process ...............................................................2-11
2.8 Conclusion.................................................................................................2-15
Chapter 3 SQS-142 Software
3.0 Introduction................................................................................................3-1
3.1 Installation .................................................................................................3-2
3.2 Operation...................................................................................................3-2
3.3 File Menu...................................................................................................3-4
3.4 Edit Menu ..................................................................................................3-5
3.4.1 Processes.............................................................................................3-6
Layers...............................................................................................3-7
Rate Ramps ......................................................................................3-9
Deposition .........................................................................................3-10
Conditioning ......................................................................................3-12
Sources and Sensors .........................................................................3-13
3.4.2 Films.....................................................................................................3-15
3.4.3 Materials ...............................................................................................3-16