Remote Processing RPC-210 - Manual (Page 53)

EXPANSION PORT & POWER BASIC SECTION 12
Page 12-2
No heat sink is necessar y if power( P (MAX ) ) is less
than 1. 7W and the board operate s at 25°C. A roug h rule
of thumb is you can draw 100 mA @5V from the board
and not require a heat sink.
Ther e is a small he at sink on the RP C-210. U19 is
screwed to the board to get slightly better heat
dissipation. However, if you are going to operate the
heat sink at high temperatures (> 80°C) for extended
periods of time, it is advisable to add a heat sink.
If you expect to operate the bo ard at high tempe ratures,
use the following formula to determine maximum power
dissipation:
P(MA X) = 125 - T
A
----------
60
W h e re : T
A
is ambient temperature.
Use a heat sink for a TO-220 IC. Suggested heat sink
types from Aavid are:
A a vi d P / N Height P(max) @
50 °C
P(max)
@ 5 0°C
577002B00000 0.25" 2.85 2.14
577102B00000 0.375 3.46 2.63
577202B00000 0.500 3.64 2.73
Other heat sink types and styles may be used depending
upon your mounting c onsidera tions. Heat dissipa tion is
greatly increased with air flow around the regulator.
Be sure to use silicone grease to increase heat flow. An
insulator is no rma lly not necessar y unless you w ant to
keep the heat sink from shorting to an external case.
You may need to bend up U19 to attach the heat sink.
LOW POWER MODES
Low power modes are discussed in SECTION 7, REAL
TIME CLOC K, L OW P OWE R MO DES.
Expansion Port Pin Out
J8 Pin Description
1 Data bus 0 line
2 External I/O select
3 Data bus 1 line
4 External power. Same as P1-E
5 Data bus 2 line
6 Interrupt 0
7 Data bus 3 line
8 Reset (active low)
9 Data bus 4 line
10 + 5V power
11 Data bus 5 line
12 Ground
13 Data bus 6 line
14 Ground
15 Data bus 7 line
16 Address line A4
17 Address line A0
18 + 5V power
19 Address line A1
20 Address line A5
21 Address line A2
22 No connection
23 Address line A3
24 ALE line
25 RD line (active low)
26 WR line (active low)