Temperature sense, Temperature sense –66 – Altera Stratix IV GX FPGA Development Board User Manual

Page 74

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2–66

Chapter 2: Board Components

Power Supply

Stratix IV GX FPGA Development Board, 530 Edition Reference Manual

November 2010

Altera Corporation

Table 2–59

lists the power measurement ADC component references and

manufacturing information.

Temperature Sense

Temperature monitoring for the Stratix IV GX FPGA die is achieved with a MAX1619
temperature sense device. The MAX1619 device connects to the MAX II CPLD
EPM2210 System Controller and the Stratix IV GX device by a 2-wire SMB interface.
The MAX 1619 device is located at address 0x1. This bus is also routed to a single
voltage and power monitor chip for the 12-V power rail at address 0x2.

The OVERTEMPn and TSENSE_ALERTn signals are driven by the MAX1619 temperature
sense device based on a programmable threshold temperature. The OVERTEMPn signal
is driven to the MAX II EPM2210 System Controller which controls OVERTEMPn. The
MAX II EPM2210 System Controller can control fan speed based on a register setting
and can also override the MAX1619 device with the FAN_FORCE_ON DIP switch to force
the fan to be on constantly at full speed. For more information on this control, refer to
the MAX II EPM2210 System Controller source code found in the development board
installation directory <install dir>\stratixIVGX_4sgx530_fpga\examples\max2.

f

For more information on the development board installation directory, refer to the

Stratix IV GX FPGA Development Kit, 530 Edition User Guide

.

6

S4VCCPT

1.5

VCCPT

Programmable power tech

7

S4VCCD_PLL

0.9

VCCD_PLL

PLL digital

8

S4VCCA_GXB

3.0

VCCA

XCVR analog TX/RX driver (mA only)

9

S4VCCIO_B5

2.5

VCCIO_B5

Bank 5 I/O power (HSMC port A)

A

S4VCCIO_B6

2.5

VCCIO_B6

Bank 6 I/O power (HSMC port B)

B

S4VCCIO_B1B2

2.5

VCCIO_B1

Bank 1 I/O power (FSM bus)

VCCIO_B2

Bank 2 I/O power (FSM bus)

C

S4VCCIO_B3A

1.8

VCCIO_B3A

Bank 3A I/O power (HDMI)

D

S4VCCIO_B3B4

1.5

VCCIO_B3

Bank 3 I/O power (DDR3BOT)

VCCIO_B4

Bank 4 I/O power (DDR3BOT)

E

S4VCC_GXB

1.1

VCCR

XCVR analog receive

VCCT

XCVR analog transmit

VCCL_GXB

XCVR clock distribution

F

Table 2–58. Power Rail Measurements Based on the Rotary Switch Position (Part 2 of 2)

Switch

Schematic Signal Name

Voltage (V)

Device Pin

Description

Table 2–59. Power Measurement ADC Component References and Manufacturing Information

Board Reference

Description

Manufacturer

Manufacturing

Part Number

Manufacturer

Website

U1, U36

8-channel differential 24-bit ADC

Linear Technology

LTC2418CGN#PBF

www.linear.com

U9

1-channel differential 12-bit ADC

Linear Technology

LTC4151CDD#PBF

www.linear.com

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