HP NonStop G-Series - Manual (Page 148)

Module
Attributes
Actions
A set of components that share a common hardware interconnection, such as a backplane. This object
applies only to S-series processor and I/O enclosures, in which each enclosure contains contains one
group , and a group contains only one module. The module is considered a subcomponent of the
group. IOAM enclosures contain two I/O adapter modules .
Example: Module 2.1
Attributes
Module
Service State
Displayed in the Attributes tab and Attributes dialog box only if the value is
something other than OK.
Values
Temperature Sensor
Current Value The current temperature, in degrees Celsius (°C), inside the enclosure of the module.
Actions
Rediscover
Causes OSM to refresh and reanalyze all components within the module. Use this action in situations
such as:
OSM does not recognize a new CRU following a CRU replacement. ●
An alarm remains after the alarm condition has been fixed. ●
Redundant Power Scrub
Note: On T0682AAC and later, this OSM action is also supported on Telco systems.
Tests fault tolerance of the power environment within the module. If the results of the action indicate
a problem, check the Power State attribute of the individual CRUs to determine where the problem
lies.
This action is run automatically at 2:00 a.m. daily. It can also be performed manually at any time.