Rockwell Automation 1336-GM6 Enhanced DeviceNet Communications Module - Manual (Page 88)

A-2 Specifications
1336-GM6 Specifications The following table gives the specifications for the 1336-GM6
Enhanced DeviceNet communications board.
Category Specifications
Dimensions 4.5" W x 2.8" H x 0.5" D
(11.43 cm x 7.112 cm x 1.27 cm)
Weight 1.8 oz
(51 g)
Operating Temperature 0 to +55
°
C (32 to 131
°
F)
Storage Temperature –40 to +85 ° C (–40 to 185 ° F)
Relative Humidity (Operating) 5 to 80% non-condensing
Relative Humidity (Non-Operating) 5 to 95% non-condensing
Shock (Operating) 30g peak acceleration, 11(+/–1)ms pulse width
Shock (Non-Operating) 50g peak acceleration, 11(+/–1)ms pulse width
Vibration (Operating) 2.5g at 5Hz – 2KHz
Vibration (Non-Operating) 5g at 5Hz – 2KHz
Power Consumption 150mA at 5V (supplied from Drive Control Board)
60mA at 24V (supplied through DeviceNet)
ESD Susceptibility (IEC 1000-4-2) 4KV contact, 8KV open air
Regulatory Agencies UL 508 and CUL
European Union EMC and Low Voltage Directives
!
ATTENTION: The 1336-GM6 communications
board contains ESD (Electrostatic Discharge) sensitive
parts. Static control precautions are required when
installing, testing, or servicing this assembly. Device
malfunction may occur if you do not follow ESD control
procedures. If you are not familiar with static control
procedures, refer to Allen-Bradley Publication
8000-4.5.2, Guarding Against Electrostatic Damage, or
other applicable ESD protection handbook.