ProSoft Technology MVI46-MBP - Manual (Page 38)

MVI46-MBP ♦ SLC Platform Reference
Modbus Plus Communication Module
Page 38 of 101 ProSoft Technology, Inc.
February 19, 2008
5.1.2 General Specifications
ƒ Single Slot - 1746 backplane compatible (Local or extended I/O rack only.
Remote rack not supported)
ƒ The module is recognized as an Input/Output module and has access to
processor memory for data transfer between processor and module using
M0/M1 files
ƒ Ladder Logic is used for data transfer between module and processor
ƒ Configuration data obtained through user-defined ladder. Sample ladder file
included
5.1.3 Hardware Specifications
Specification Description
Backplane Current Load 800 ma @ 5V (from backplane)
Operating Temperature 0 to 60°C (32 to 140°F)
Storage Temperature -40 to 85°C (-40 to 185°F)
Shock 30g operational, 50g non-operational
Relative Humidity 5% to 95% (non-condensing)
Vibration 5 g from 10150 Hz
Processor Compatible with Rockwell Automation SLC 5/02 M0/M1
capable processors or newer
LED indicators Module status, Backplane transfer status, Application
status, Serial activity and error LED status
Debug/Configuration port (CFG)
CFG Port (CFG) RJ45 (DB-9M with supplied cable)
RS-232 only
Configuration Connector RJ45 RS-232 Connector (RJ45 to DB-9 cable shipped
with unit)
Application Ports
Modbus Plus ports Dual DB9 Application ports for redundant operation
5.1.4 Functional Specifications
ƒ Communication parameters
o
Baud: 57,600 (fixed)
o
Parity: none (fixed)
o
Stop: 1 (fixed)
ƒ Modbus Plus ports
o
User-definable module memory usage
o
Support for the storage and transfer of up to 4,000 registers across the
backplane
o
100 word reads and writes (max. allowed)
o
Supports all five levels of Modbus Plus routing
o
Software configurable parameters Node address: 1 to 64
o
Global out size: 0 to 32 words
o
Global in size: 0 to 32 words
o
Module data transfer: 0 to 4,000 words
o
Master command count: 0 to 100 commands