Document Outline

• MF2-CVRG
• MF2-PFG
  • Preface
  • Warranty
    • SYCON INSTRUMENTS, INC. Policy
    • EQUIPMENT RETURN
  • Table of Contents
  • List of Figures
  • List of Tables
• MF2-S1G
  • GENERAL INFORMATION
    • INTRODUCTION
      • SECTION 1.1
    • UNPACKING
      • SECTION 1.2
    • STM-100 / MF SPECIFICATIONS
      • SECTION 1.3
    • SENSOR SPECIFICATIONS
      • SECTION 1.4
        • Figure 1.1: Standard Sensors.
        • OPERATION
    • FEEDTHROUGH INSTALLATION
      • WATER
      • ELECTRICAL
      • MATERIALS (IN VAC)
    • SENSOR SPARE PARTS
      • SECTION 1.5
    • STM-100 / MF PARTS & ACCESSORIES
      • SECTION 1.6
        • MONITOR
        • FEEDTHROUGHS
        • SENSORS
        • OPTIONS
        • ACCESSORIES
        • SENSOR CRYSTALS
• MF2-S2G
  • OPERATION AND PROGRAMMING
    • KEYBOARD DESCRIPTION
      • SECTION 2.1
        • Figure 2.1: STM-100 / MF Front Panel.
    • SYSTEM CONTROL KEY GROUP
      • SECTION 2.2
        • Figure 2.2: System Control Keys.
        • Shutter Keys
        • ZERO Key
        • Crystal Life Key
    • DATA ENTRY AND PROGRAMMING GROUP
      • SECTION 2.3
        • Figure 2.3: Data Entry And Programming Keys.
        • Program Key
        • Enter Key
        • Arrow Keys
    • FILM PARAMETERS
      • SECTION 2.4
        • LCD Data Displays
          • Figure 2.4: LCD Data Areas.
          • Figure 2.5: LCD Variable Parameter Legends.
        • Film Number Parameter
          • Figure 2.6: Film Number Parameter.
          • Figure 2.7: Density Parameter.
        • Density Parameter
          • Figure 2.8: Z-Factor Parameter.
        • Z-Factor Parameter
          • Figure 2.9: End Thickness Parameter.
        • End Thickness
          • Figure 2.10: Set Point Thickness Parameter.
        • Setpoint Thickness Parameter
          • Figure 2.11: Set Point Timer Parameter.
        • Setpoint Timer
          • Figure 2.12: Tooling Parameter.
        • Tooling Factor Parameter
    • USER CONFIGURATION SWITCHES
      • SECTION 2.5
        • Figure 2.13: Configuration Switch Settings.
    • SWITCH FUNCTION DEFINITIONS
      • Configuration
        • Table 2.1: Baud Rate Switch Settings
        • Table 2.2: Configuration Switch Address Settings
    • TEST MODE
      • SECTION 2.6
        • Enabling the Test Mode
    • BEEPER
      • SECTION 2.7
        • Disabling the Beeper
• MF2-S3G
  • INSTALLATION
    • Electrical Connections and Descriptions
      • SECTION 3.1
        • Figure 3.1: Rear Panel.
      • SECTION 3.2
        • Line Power Warning
        • Line Voltages
    • GROUND
      • SECTION 3.3
        • Grounding
          • Figure 3.2: Recommended Grounding Procedure.
        • Connector Shielding
    • I/O INTERFACE CONNECTION
      • SECTION 3.4
        • I/O Connector
        • RELAYS
        • INPUTS
    • RELAY OUTPUTS
      • Relay Outputs
      • Crystal Fail
      • Elapsed Timer
      • Shutter
      • Thickness Setpoint
    • REMOTE INPUTS
      • Remote Inputs
      • Shutter Relays
      • Thickness Zero Input
      • Timer Zero Input
      • Remote Input Specifications
    • SENSOR CONNECTION
      • SECTION 3.5
        • Oscillator Connection
    • ANALOG RECORDER INTERFACE
      • SECTION 3.6
        • Analog Output Specifications
          • Figure 3.3: Recorder Output Plug.
        • RECORDER CALIBRATION
          • Figure 3.4: Example of Thickness Mode Recorder Output.
        • Recorder Outputs
          • Figure 3.5: Example of Rate Mode Recorder Output.
    • RS-232 SERIAL COMMUNICATIONS INTERFACE
      • SECTION 3.7
        • RS-232 Connections
        • RS-232 CONNECTOR DEFINITIONS
          • Figure 3.6: Cable Connections From STM to MSDos Computers.
    • COMMUNICATIONS OPTIONS
      • SECTION 3.8
        • Communications Options
          • Figure 3.7: Typical System.
    • DEPOSITION SYSTEM INSTALLATION
      • SECTION 3.9
        • System Installation
        • Sensor Installation
          • Figure 3.8: Head Mounting Dimensions.
    • Installing Water Lines
      • Water Lines
    • VACUUM FEEDTHROUGH
      • Vacuum Feedthrough
    • ELECTRICAL IN-VACUUM CABLE
      • Vacuum Electrical Connections
      • Bakeable Sensor
• MF2-S4G
  • Calibration and Theory
    • Measurement Theory
      • SECTION 4.1
        • Equation 1:
        • Measuring Period
        • Rate Computation
    • Thickness Reading Calibration
      • SECTION 4.2
        • Thickness
    • Density Determination
      • Density
    • Z-Factor Determination
      • Z-Factor
    • Tooling Determination
      • Figure 4.1: Typical Tooling Factors.
      • SECTION 4.3
    • Material Reference Table
      • Bulk Density and Z-Factor Values
      • Aluminum through Indium
        • Table 4.1: Common Material Reference Table
      • Indium Intimonide through Tantalum
        • Table 4.1: Common Material Reference Table, Continued
      • Telurium through Zirconium Oxide
        • Table 4.1: Common Material Reference Table, Continued
• MF2-S5G
  • COMPUTER INTERFACING
    • RS-232 INTERFACE
      • SECTION 5.1
        • RS-232 Description
    • BAUD RATES and CABLING
      • Figure 5.1: Cable Connection From STM-100 / MF to IBM-AT.
      • Making an RS-232 Cable
        • Figure 5.2: Connections for STM-100 / MF to PC Compatible Computers.
      • Communication Demo Disk
      • Setting Baud Rates
        • Table 5.1: Baud Rate Configuration Table.
    • Sycon Protocol
      • SECTION 5.2
        • Message Format
        • Basic Driver Routine
          • Figure 5.3: BASIC Driver Routine.
    • SECS-II Protocol
      • SECTION 5.3
        • SECS-II Addressing
        • SECS-II Protocol
        • Documentation Requirements
        • General Information
        • Message Summary
        • SECS-II Messages
        • Message Details
    • IEEE-488 INTERFACE OPTION
      • SECTION 5.4
    • COMMANDS
      • SECTION 5.5
        • Figure 5.4: HP-85 IEEE-488 BASIC Driver Program.
    • RESPONSE FORMAT
      • Command List For STM-100 / MF
        • Table 5.2: Communication Command Summary.
    • DETAILED COMMAND DESCRIPTION
      • SECTION 5.6
        • Software Version Code
        • Shutter Relay Control
        • Zero Thickness and Timer
        • Zero Thickness
        • Zero Timer
        • Set the Density Parameter
        • Set the Z-Factor Parameter
        • Set the End Thickness
        • Set the Setpoint Relay Thickness
        • Set the Timer Relay Parameter
        • Set the Tooling Factor Parameter
        • Turn the Test Mode On/Off
        • Acknowledge the Status of Non-Volitile Memory
        • Get the Crystal Fail Status
        • Get the Status of the Setpoint Timer Relay
        • Get the Status of the Setpoint Thickness Relay
        • Get the Status of the End Thickness Relay
        • Get the Remote Input Status
        • Get the Configuration Switch Status
        • Get the Thickness Value
        • Get the Rate Value
        • Get the Sensor Frequency
        • Get the Crystal Life Value
        • Get the Timer Value
        • Get the Shutter Close Event Thickness Log
        • Get the Shutter close Time Log
        • Get the Log Event Rate
        • Get the Power on Status
        • Force Parameters to Their Default Values
        • Turn the Key Board Beeper On/Off
        • Internal Use Commands
        • Multi-Film Film Number Selection
        • Multi-Film Density Parameter
        • Multi-Film Z-Factor Parameter
        • Multi-Film End Thickness Parameter
        • Multi-Film Set Point relay Thickness Parameter
        • Multi-Film Set Point Timer Relay Parameter
        • Multi-Film Tooling Factor Parameter
• MF2-S6G
  • MAINTENANCE
    • Warnings
      • SECTION 6.1
    • CONTROL UNIT
    • REPLACING A SENSOR CRYSTAL
      • SECTION 6.2
    • Persistent Crystal Fail Indication
      • SECTION 6.3
        • Figure 6.1: Sensor and Feed Through Connections.
        • Figure 6.2: Test Oscillator OSC-100A.
        • Figure 6.3: SM75, MicroDot( Connector.
• Mf2-apdxG
  • Communication Demo Disk
    • Section A-1
    • STM-100 /MF Specific Programs
      • Section A-2
  • SHMX-4 Operation
    • Introduction
      • Figure C.1: SHMX-4 Front Panel
      • Figure C.2: Firmware ROM Label
    • Operation
    • Installation
      • Figure C.3: SHMX-4 Back Panel
      • Figure C.4: SHMX-4 to STM-100 Control Cable