Figure4.3 lsi53c875n pin diagram, Lsi53c875n pin diagram, 4 signal descriptions – Avago Technologies LSI8751D User Manual

Page 96

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4-4

Signal Descriptions

Figure 4.3

LSI53C875N Pin Diagram

NC

NC

NC

BYTEPAR2

AD22

AD19

AD18
AD17

FRAME/

TRDY/

V

DD-I

STOP/

BYTEPAR1

AD13

V

SS

AD12

1

3

5

7

9

11

13

15

17

19

21

23

25

27

29

31

33

35
36
37
38
39
40

AD21

V

DD-I

PAR

V

SS

2

4

6

8

10

12

14

16

18

20

22

24

26

28

30

32

34

NC

NC

IDSEL

V

SS

AD20

V

SS

C_BE2/

IRDY/

DEVSEL/

PERR/

C_BE1/

AD14

C_BE3/

AD23

AD16

V

SS

V

SS

V

SS

AD15

V

DD-I

NC

NC

NC

SDIRP0

SD13

SDP1/

SD1/
V

SS-S

SD5/

SD7/

SATN/
V

SS-S

V

SS-S

SI_0/
SD8/
V

SS-S

156

154

152

150

148

146

144

142

140

138

136

134

132

130

128

126

124

122
121
120
119
118
117

SD14/

SD15/

SRST/

SSEL/

155

153

151

149

147

145

143

141

139

137

135

133

131

129

127

125

123

NC

NC

SDIR7

SD12/

V

SS-S

SD0/

SD4/

V

SS-S

SDP0/

SACK/

SMSG/

SREQ/

NC

V

DD

SD2/
SD3/

SD6/

SBSY/

SC_D/

SD9/

NC

NC

NC

AD5

AD3

AD0

IRQ/

GPIO0_FETCH

TESTIN

TD0

MAD6

MAD5

MAD0

GPIO3

GPIO4

DIFFSENS

AD2

AD1

MAD3

MAD1

NC

NC

V

SS

V

DD-I

V

SS

V

DD-C

SCLK

TMS

MAD7

V

DD

MAD2

V

SS

AD6

AD4

GPIO1_MASTER/

V

SS-C

MA

C/_TEST

OUT

MAD4

GPIO2_MAS2/

SDIRP1

SDIR15

SDIR14

MAS1

MWE/

MCE/

BIG_LIT/

GNT/

BYTEP

AR3

AD31

AD30

AD29

AD28

V

DD-I

V

SS

169

171

173

175

177

179

181

183

185

187

189

191

192

193

194

195

196

198

200

202

204

206

SDIR0

RST/

V

SS-C

AD27

AD26

AD24

NC

NC

208

NC

170

172

174

176

178

180

182

184

186

188

190

197

199

201

203

205

207

V

DD

TCK

SDIR12

MAS0/

MOE/

SERR/

CLK

V

DD-C

V

SS

SDIR13

V

DD

TDI

REQ/

V

SS

AD25

NC

53

55

57

59

61

63

65

67

69

71

73

75

77

79

81

83

85

87

88

89

90

91

92

54

56

58

60

62

64

66

68

70

72

74

76

78

80

82

84

86

LSI53C875N

PCI to SCSI I/O Processor

208-Pin

Quad Flat Pack

156

154

152

150

148

146

144

142

140

138

136

134

132

130

128

126

124

122
121
120
119
118
117

155

153

151

149

147

145

143

141

139

137

135

133

131

129

127

125

123

116

114

112

110

108

106

115

113

111

109

107

105

SD10/

V

DD

SDIR9

NC

NC
NC

SD11/

SDIR8

NC

NC

SDIR10

NC

41

43

45

47
48
49
50
51
52

42

44

46

C_BE0/

NC
NC
NC

AD9

AD8

AD10

V

SS

AD7

AD11

BYTEPAR0

NC

93

95

97

99

100

101

102

103

104

94

96

98

TGS

V

DD

SDIR11

NC

NC

NC

RSTDIR

V

SS

SELDIR

BSYDIR

NC

IGS

NC

NC

NC

SDIR6

SDIR3

157

159

161

163

165

167

NC

158

160

162

164

166

168

NC

NC

SDIR4

SDIR2

SDIR5

V

SS

SDIR1

Note: The decoupling capacitor arrangement shown in Figures 4.1 and 4.2 is recom-

mended to maximize the benefits of the internal split ground system. Capacitor val-
ues between 0.01 and 0.1

µ

F should provide adequate noise isolation. Because of

the number of high current drivers on the LSI53C875, a multilayer PC board with
power and ground planes is required.

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