Rockwell Automation MV SMC Flex OEM Components - Manual (Page 50)

8-2 Final Test Procedures
1503E-IN001E-EN-P – June 2013
• Do not remove the plastic plugs from unused fiber optic
transmitters on the circuit boards.
•
Verify that the fiber optic cables between the interface board and
the gate driver boards are connected to the correct power phase.
• Check the routing of the twisted pair of red and white cathode and
gate wires from the SCRs. They can safely touch the heatsink on
the side of the SCR that they are exiting; however, they must not
touch the heatsink on the other side of the SCR. The wires must be
properly supported to ensure this condition is met. The gate leads
must be arranged in the same sequence - top to bottom – as
connected to the gate driver boards. See wiring diagrams in
Chapter 7 for the sequences.
• Verify g
round wire connection (if required) at the interface board
(refer to page 5-3).
• Wiring to the voltage sensing board from the power stacks must be
rated for the line voltage. Rockwell Automation recommends UL
style 3239, #18 AWG, 40 kVDC silicone rubber insulated wire for
this application.
•
If the bypass vacuum contactor (and capacitor contactor if
applicable) is Series D or earlier, then the contactor must have a
fast drop-out time (typically 50 milliseconds or less) When using
Series E or later vacuum contactors, the drop-out delay is
controlled by the IntelliVAC module (set for minimum delay of 50
milliseconds).
Dielectric Test
1. Remove the six high voltage wires from the voltage sensing board,
and isolate the ends to prepare for the Hi-Pot test.
2. Jumper the heatsinks together within each phase as shown in Table
8.B. See Figure 8.1 for the jumper positioning on the 4160V,
360A heatsink.
Table 8.B – Jumper Configuration for Hi-Pot Testing
800 – 2400 V
Power Stacks
3300/4160 V
Power Stacks
6900 V
Power Stacks
Jumper 1, 2 Jumper 1, 2, 4 Jumper 1, 2, 3, 6
Final Test Procedures
(cont.)