Yokogawa Low Concentration (ppm) Zirconia Oxygen Analyzer OX400 - Manual (Page 10)

<1. Outline> 1-1
IM 11M10B01-01E
1. Outline
The OX400 is a highly accurate and reliable low concentration zirconia oxygen analyzer that is
capable of measuring a wide range of concentrations, from 0-10 ppm up to 0-100 vol% O
2
. This is
the latest oxygen analyzer from Yokogawa, and its development was based on the company’s long
experience and strong track record with this technology.
A proprietary new thin-film deposition technology was used in the zirconia sensor that creates a
molecular bond between the zirconia element and the platinum layer. This prevents separation,
enables a reduction in sensor size and ensures a high-speed response and long life.
The OX400 can be used to control and monitor various semiconductor applications, and to control
environment, air leakage into inert gas, and other processes.
Features
Long life and high-speed response
• Thanks to the use of Yokogawa’s proprietary new thin-film deposition technology, the sensor has
three times the lifespan of those used in our earlier products.
• A cylindrical sensor design facilitates the replacement of measurement gases, thereby helping to
assure a high-speed response.
High performance and high reliability
• Superior repeatability and linearity even at low oxygen concentrations
• Either pump or aspirator sampling can be selected, depending on the application.
Built-in functions and a variety of self-diagnosis functions
• Comes with multi selector, auto range, partial range, and pump on/off functions
• A variety of self-diagnosis functions are provided that detect malfunctions such as heater
temperature error, temperature sensor burnout, and sensor resistance value error.
Superior maintainability
• The sensor can be replaced on-site.
• Compact and lightweight for easy installation.
Applications
• Oxygen concentration control in semiconductor-related diffusion and drying furnaces and in LCD
manufacturing processes
• Oxygen concentration control in solder pot flow and re-flow ovens, and glove boxes used in
electronics manufacturing, and in gas production processes
• Oxygen concentration measurements to prevent dust explosions during powder transfer