System overview – Artesyn Centellis 2000 Shelf - DC Installation and Use (June 2014) User Manual

Page 56

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System Overview

Centellis 2000 Shelf - DC Installation and Use (6806800G45F)

56

This system contains boards with embedded power sources rated greater than 150 W.

To support NEBS compliance (Telcordia GR-1089-CORE, section 9.8.2, requirement R9-14),
shelf ground (chassis ground) and logic ground (logic signal return) are connected to the shelf
at the backplane with a screw assembled for that purpose. This screw is assembled in the upper
part of the RTM slot on the backplane near the RTM alignment pin. The screw can be removed
according to field requirements.

For more information please refer to Telcordia GR-1089-CORE, section 9.8.2, requirement R9-14.

In the AdvancedTCA Specification the connection of shelf ground to logic ground is described as
an option.

To satisfy the requirements for marking electrical and electronic equipment in accordance
with article 11 (2) of Directive 2002/96/EC, Waste from Electrical and Electronic Equipment
(WEEE), Artesyn Embedded Technologies includes a crossed-out bin symbol on all standard
and noncustom chassis product. This marking fulfills the requirement set out by WEEE that a
producer of an electrical or electronic appliance that bears their trade name and is put on the
European Union market after 13 August 2005, places a clearly identifiable mark on the

The products listed in the ordering information for spare parts and accessory kits are
designed to meet the Directive on the restriction of the use of certain hazardous substances
in electrical and electronic equipment (RoHS), DIRECTIVE 2002/95/EC.

The system is compliant to NEBS and ETSI acoustic noise emission standards, if the system is
equipped with Artesyn Embedded Technologies blades and with properly designed and
configured third party blades. In a system thus configured, the fans will settle at
approximately 12% speed at an ambient temperature of 23 ºC (+/- 2º C) (73.4 °F +/- 3.6 °F)
under normal operating conditions.

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