Rockwell Automation AADvance Controller Solutions Handbook - Manual (Page 46)

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1-34 Document: 553631
(ICSTT-RM447J_EN_P) Issue: 09:
Solutions Handbook (AADvance Controller)
Base units are moulded from a similar material. Each base unit can be mounted onto
standard DIN rails or directly onto a panel or wall. The moldings incorporate slots and
clamps for DIN rail mountings, and holes for screw fixing.
CAUTION HEAT DISSIPATION AND ENCLOSURE POSITION
System and field power consumption by modules and termination assemblies is
dissipated as heat. You should consider this heat dissipation on the design and
positioning of your enclosure; e.g. enclosures exposed to continuous sunlight
will have a higher internal temperature that could affect the operating
temperature of the modules. Modules operating at the extremes of the
temperature band for a continuous period can have a reduced reliability.
Module Polarization Keying
For each I/O Module there is a matched termination assembly set. The controller
incorporates module polarization keying to ensure they are matched when installed.
Modules have polarized sockets that align and mate with coding pegs located on the
termination assembly. The alignment of the sockets and pegs ensure only the matched
I/O module type can be fitted into each associated termination assembly and only a
processor can be installed on a processor base unit.