Artesyn MVME55006E Single Board Computer Installation and Use (July 2014) - Manual (Page 121)

Appendix B
MVME55006E Single Board Computer Installation and Use (6806800A37J) 121
B
Thermal Validation
B.1 Overview
Board component temperatures are affected by ambient temperature, air flow, board
electrical operation and software operation. In order to evaluate the thermal performance of a
circuit board assembly, it is necessary to test the board under actual operating conditions.
These operating conditions vary depending on system design.
While Artesyn performs thermal analysis in a representative system to verify operation within
specified ranges, refer to
Appendix A, Specifications , you should evaluate the thermal
performance of the board in your application.
This appendix provides systems integrators with information which can be used to conduct
thermal evaluations of the board in their specific system configuration. It identifies thermally
significant components and lists the corresponding maximum allowable component
operating temperatures. It also provides example procedures for component-level
temperature measurements.
B.2 Thermally Significant Components
The following table summarizes components that exhibit significant temperature rises. These
are the components that should be monitored in order to assess thermal performance. The
table also supplies the component reference designator and the maximum allowable
operating temperature.
You can find components on the board by their reference designators as shown in Figure B-2
and Figure B-1 . Versions of the board that are not fully populated may not contain some of
these components.