Artesyn MVME55006E Single Board Computer Installation and Use (July 2014) - Manual (Page 122)

Thermal Validation
MVME55006E Single Board Computer Installation and Use (6806800A37J) 122
The preferred measurement location for a component may be junction, case, or air as specified
in the table. Junction temperature refers to the temperature measured by an on-chip thermal
device. Case temperature refers to the temperature at the top, center surface of the
component. Air temperature refers to the ambient temperature near the component.
Table B-1 Thermally Significant Components
Reference
Designator Generic Description
Max. Allowable
Component
Temperature (deg.
C)
Measurement
Location
U2, U3 Flash, soldered 85 Ambient
U16 Gigabit Ethernet 119 Case
U22 System controller 110 Case
U24 MPC7457 processor 103 Case
U25 VME-to-PCI bridge 70 Ambient
U27 Clock buffer 95 Case
U31 PCI bridge 70 Ambient
U41-43, U45-
47, U54-56,
U60-62, U64-
66, U67-69 SDRAM 85 Case
U123-124 L3 Cache 115 Case