Document Outline

• Cover Page
• Title Page
• Trademarks
• Declaration Of Conformity
• Registration Card
• Warranty
• Table Of Contents
• Chapter 1 Introduction and Specifications
  • 1.1 Instrument Safety
    • 1.1.1 Notes, Cautions, Warnings
    • 1.1.2 General Safety Information
    • 1.1.3 Earth Ground
    • 1.1.4 Main Power Connection
  • 1.2 Introduction to the Instrument
  • 1.3 Specifications
    • 1.3.1 Specifications XTM/2
      • 1.3.1.1 General
      • 1.3.1.2 Measurement
      • 1.3.1.3 Recorder Output
      • 1.3.1.4 Input/Output
      • 1.3.1.5 Display
      • 1.3.1.6 Process Variable Storage
      • 1.3.1.7 Hardware Interface
      • 1.3.1.8 Operation
      • 1.3.1.9 Mechanical
    • 1.3.2 Transducer Specifications (optional)
    • 1.3.3 XIU (Crystal Interface Unit) Specifications
  • 1.4 Guide to the Use of the Manual
  • 1.5 How To Contact Customer Support
    • 1.5.1 Application Support
    • 1.5.2 Field Service and Repair Support
    • 1.5.3 Returning Your Instrument
• Chapter 2 Quick Use Guide
  • 2.1 Unpacking, Initial Inspection and Inventory
    • 2.1.1 Unpacking and Inspection Procedures
    • 2.1.2 Inventory
      • 2.1.2.1 XTM/2 System Configuration
      • 2.1.2.2 Ship Kit - XTM/2
  • 2.2 Voltage Selection
  • 2.3 Installation Guide and Schematic
  • 2.4 XTM/2 Front Panel Description
    • 2.4.1 XTM/2 Front Control Panel Description
    • 2.4.2 XTM/2 Display Description
  • 2.5 XTM/2 Rear Panel Description
    • 2.5.1 Power Module
    • 2.5.2 Configuration Switches 1 & 2
    • 2.5.3 Grounding Stud
    • 2.5.4 System I/O
    • 2.5.5 RS232
    • 2.5.6 Sensor
    • 2.5.7 International Warning Symbol for Users and Technicians
    • 2.5.8 Recorder
    • 2.5.9 Comm. Option
    • 2.5.10 Manufacturer’s Identification and Serial Number Plate
  • 2.6 Operation as a Deposition Monitor
    • 2.6.1 Monitoring - Systems Without a Source Shutter
    • 2.6.2 Monitoring - Systems with a Source Shutter
    • 2.6.3 Rate Sampling
  • 2.7 Nontraditional Applications
    • 2.7.1 Etching
    • 2.7.2 Immersion in Liquids
    • 2.7.3 Biological
    • 2.7.4 Measurement of Liquids
    • 2.7.5 Use as a Frequency Counter
    • 2.7.6 Contamination Detection
• Chapter 3 Installation
  • 3.1 Installing the Instrument - Details
    • 3.1.1 Control Unit Installation
  • 3.2 Electrical Grounding and Shielding Requirements
    • 3.2.1 Verifying / Establishing Earth Ground
    • 3.2.2 Connections to Earth Ground
    • 3.2.3 Minimizing Noise Pickup from External Cabling
  • 3.3 Connection to Rear Panel
    • 3.3.1 The BNC Connectors
    • 3.3.2 The "D" Shell Connectors
  • 3.4 Sensor Selection Guide
  • 3.5 Guidelines for Transducer Installation
    • 3.5.1 Sensor Installation
    • 3.5.2 CrystalSix
    • 3.5.3 Check List for Transducer Installation
  • 3.6 Use of the Test Mode
    • 3.6.1 Operational Test
  • 3.7 Input and Output Details
    • 3.7.1 Relays
    • 3.7.2 Inputs
    • 3.7.3 Chart Recorder
  • 3.8 Computer Communications
    • 3.8.1 Communications Setup
      • 3.8.1.1 IEEE Settings for a National Instruments IEEE-GPIB Board
    • 3.8.2 Basic Command Structure
    • 3.8.3 Service Requests and Message Available
    • 3.8.4 Datalogging
    • 3.8.5 Computer Command Details
      • 3.8.5.1 Echo Command
      • 3.8.5.2 Hello Command
      • 3.8.5.3 Query Command
      • 3.8.5.4 Update Command
      • 3.8.5.5 Status Command
      • 3.8.5.6 Remote Command
    • 3.8.6 Examples of RS232 Programs
      • 3.8.6.1 Example of SEMI II Program
    • 3.8.7 Example of IEEE488 Program
• Chapter 4 Programming System Operation Details
  • 4.1 State and Measurement System Sequencing
  • 4.2 State Descriptions
  • 4.3 Parameter Limits
  • 4.4 Crystal Fail
  • 4.5 Crystal Fail Inhibit
  • 4.6 Crystal Life and Starting Frequency
• Chapter 5 Calibration and Measurement
  • 5.1 Importance of Density, Tooling and Zratio
  • 5.2 Determining Density
  • 5.3 Determining Tooling
  • 5.4 Laboratory Determination of Zratio
  • 5.5 Measurement Theory
    • 5.5.1 Basics
    • 5.5.2 Monitor Crystals
    • 5.5.3 Period Measurement Technique
    • 5.5.4 Z-Match Technique
    • 5.5.5 Active Oscillator
    • 5.5.6 ModeLock Oscillator
• Chapter 6 Adjustments and Problems
  • 6.1 LCD Contrast Adjustment
  • 6.2 Error Messages
    • 6.2.1 Powerup Errors
    • 6.2.2 Parameter Update Errors
    • 6.2.3 Other Errors
  • 6.3 Troubleshooting Guide
    • 6.3.1 Major Instrument Components, Assemblies and Mating Connectors
    • 6.3.2 Troubleshooting the Instrument
    • 6.3.3 Troubleshooting Transducers/Sensors
    • 6.3.4 Troubleshooting Computer Communications
    • 6.3.5 Leaf Spring Concerns
  • 6.4 Replacing the Crystal
    • 6.4.1 Standard and Compact
    • 6.4.2 Shuttered and Dual Sensors
    • 6.4.3 Bakeable Sensor
    • 6.4.4 Sputtering Sensor
    • 6.4.5 Crystal Snatcher
  • 6.5 Crystal Sensor Emulator IPN 760-601-G1 or 760-601-G2
    • 6.5.1 Diagnostic Procedures
      • 6.5.1.1 Measurement System Diagnostic Procedure
      • 6.5.1.2 Feed-Through Or In-Vacuum Cable Diagnostic Procedure
      • 6.5.1.3 Sensor Head Or Monitor Crystal Diagnostic Procedure
      • 6.5.1.4 System Diagnostics Pass But Crystal Fail Message Remains
    • 6.5.2 % XTAL Life
    • 6.5.3 Sensor Cover Connection
      • 6.5.3.1 Compatible Sensor Heads
      • 6.5.3.2 Incompatible Sensor Heads
    • 6.5.4 Specifications
• Appendix A Table of Densities and Z-ratios
• Index