1 front panel cooling area, 2 pci cooling area, 3 cpu / memory / hdd cooling area – Kontron TIGW1U Carrier Grade Server User Manual

Page 22: 11 hardware requirements, 1 processor, 2 memory, 1 processor 2.11.2 memory

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TIGW1U server—Features

Kontron Carrier Grade Server TIGW1U

Product Guide, rev. 1.3

December 2009

22

2.10.1

Front Panel Cooling Area

The left one-fourth of the SFP board and the portion of the power distribution board

(PDB) in this area are cooled by 40 x 40 x 56 mm PSU dual-rotor fans. One PSU fan is

sufficient to cool this portion of the front panel board area and two PSU fans provide

cooling redundancy for this area.

PSU fans draw air in through the front bezel and from vents in the left front side of the

chassis. The air is exhausted out the rear of the PSUs. The left wall of the PCI fan air

duct and the PSU guide wall provide an air flow barrier between the front panel board

cooling area and the PCI cooling area.

2.10.2

PCI Cooling Area

The 40 x 40 x 28 mm single-rotor PCI fan cools the portions of the server board, PDB,

and SFP that are in this area as well as a PCI add-in card installed in the riser card

assembly.

The PCI fan draws in air is through the front bezel and exhausts through the rear of the

system. A plastic air duct directs the air flow in this area, houses the PCI fan, and

provides air flow barriers between:

• The front panel board and the PCI cooling areas
• The PCI and the CPU / memory / HDD cooling areas

A second plastic part behind the PCI air duct continues the air flow barrier between the

PCI cooling area and the CPU / memory / HDD cooling area. The riser card provides the

third portion of the air flow barrier between the PCI cooling area and the CPU / memory

/ HDD cooling area.

2.10.3

CPU / Memory / HDD Cooling Area

The server uses four 40 x 40 x 56 mm dual-rotor fans that are assembled in a sheet

metal bracket attached to the chassis.

The server draws air in through the front bezel and exhausts it out the rear of the

chassis. The CPU / memory / HDD cooling area air flow path is isolated from the rest of

the system by an air duct and riser card. Air entering the CPU / memory air duct is

preheated by the hard drives.

2.11

Hardware Requirements

To avoid integration difficulties and possible board damage, your system must meet the

requirements outlined in the subsections below. For a list of qualified components, see

Section 1.4

,

“Additional Information and Software”

.

2.11.1

Processor

The S5000PHB server boardaccommodates two Dual-Core Intel

®

Xeon

®

processor

5100 Series or two Quad-Core Intel

®

Xeon

®

processor 5400 series.

2.11.2

Memory

The S5000PHB server board supports up to six DDR2-533 or DDR2-667 Fully Buffered

DIMMs (FBD memory) in six DIMM slots across two channels, Channel 0 and Channel 1.

Channel 0 consists of DIMM sockets A1, A2, and A3. Channel 1 consists of DIMM

sockets B1, B2, and B3. See

Section 3.4.2, “Configuring Memory DIMMs” on page 34

for population rules and configuration information.

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