Xilinx DS610 - Manual (Page 64)

Spartan-3A DSP FPGA Family: Pinout Descriptions
DS610 (v3.0) October 4, 2010 www.xilinx.com
Product Specification 64
Electronic versions of the package pinout tables and foot- prints are available for download from the Xilinx® website. Using
a spreadsheet program, the data can be sorted and reformatted according to any specific needs. Similarly, the ASCII-text file
is easily parsed by most scripting programs.
www.xilinx.com/support/documentation/data_sheets/s3a_pin.zip
Package Overview
Table 60 shows the two low-cost, space-saving production package styles for the Spartan-3A DSP family.
Each package style is available as a standard and an environmentally friendly lead-free (Pb-free) option. The Pb-free
packages include an extra ‘G’ in the package style name. For example, the standard “CS484” package becomes “CSG484”
when ordered as the Pb-free option. The mechanical dimensions of the standard and Pb-free packages are similar, as
shown in the mechanical drawings provided in
Table 61 .
For additional package information, see UG112 : Device Package User Guide.
Mechanical Drawings
Detailed mechanical drawings for each package type are available from the Xilinx web site at the specified location in
Table 61 .
Material Declaration Data Sheets (MDDS) are also available on the Xilinx web site for each package.
Table 60: Spartan-3A DSP Family Package Options
Package Leads Type
Maximum
I/O
Lead Pitch
(mm)
Footprint
Area (mm)
Height
(mm)
Mass (1)
(g)
CS484 / CSG484 484 Chip-Scale Ball Grid Array (CS) 309 0.8 19 x 19 1.80 1.4
FG676 / FGG676 676 Fine-pitch Ball Grid Array (FBGA) 519 1.0 27 x 27 2.60 3.4
Notes:
1. Package mass is
±10%.
Table 61: Xilinx Package Documentation
Package Drawing MDDS
CS484 Package Drawing PK230_CS484
CSG484 PK231_CSG484
FG676 Package Drawing PK155_FG676
FGG676 PK111_FGG676