Gas type, Argon – Arc Machines 307 User Manual

Page 154

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Arc Machines, Inc. Model 307 Orbital Tube Welder Training

Document No. 740096

Chapter 16. Page 1.

Rev. A

C

hapter 16. Purging Requirements

for Orbital Welding

etals have a tendency to oxidize in

air. This tendency is accelerated

when heated to welding tempera-

tures. Moisture, and even nitrogen, which

forms the largest component of the at-

mosphere, may have detrimental effects

on some metals. In the GTAW process an

inert shielding gas is supplied to the

weld head to protect the electrode, the

molten weld puddle and adjacent areas

from oxidation. For autogenous orbital

welding in enclosed weld heads, the head

forms a chamber of inert gas providing

protection of the entire O.D. weld joint.

A backing or purge gas is applied to the

I.D. of the weld joint to prevent the for-

mation of oxides or other detrimental

surface substances and to provide pres-

sure for the weld profile. Backing gas is

required for high-purity orbital welding

and for tack welding (if tack welds are

permitted).

Gas type

Argon
Argon is the most commonly used gas for both shield and backing during

GTA welding of 316L stainless steels in the biotechnology and pharmaceu-

tical industries, while a gas mixture containing 1 to 5% hydrogen is often

used in the semiconductor industry. The type of gas used as a shield gas

has a profound effect on the character of the arc and the depth of weld pen-

etration. Gas mixtures of helium and argon (75% helium/25% argon), as

well as argon and hydrogen (95% argon/5% hydrogen), provide a hotter

arc than pure argon and deeper penetration at the same current settings.

The gas type is considered to be an essential variable for weld procedure

qualifications and a change from one gas type to another or to a gas mixture

requires requalification of the welding procedure. Welding operators must

also be requalified when there is a change of gas type or gas mixture.

Large argon dewar outside a cleanroom is used
for purging welds on high-purity semiconductor
and pharmaceutical piping assemblies. Photo
courtesy of Murray Company.

Ar
He/Ar
Ar/H

2

M

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