Yaskawa GPD 506/P5 Section Three - Manual (Page 48)

PP.P5G5.03.Troubleshoot
Page 48
Rev. 06/11/2003
Power Component Replacement
Correct Method for Replacement of Circuit Board Mounted Components
When mounted correctly, the power module with thermal compound applied, will be
in contact with the heatsink. The specifications for the thermal compound can be
found on the following page.
POWER BOARD
THERMAL
COMPOUND
7MBR30NF060
POWER MODULE
HEAT SINK