Document Outline

• Cover Page
• Title Page
• Trademarks
• Disclaimer
• Copyright
• Declaration Of Conformity
• Warranty
• Table Of Contents
• Chapter 1 Introduction and Specifications
  • 1.1 Introduction
    • 1.1.1 Related Manuals
  • 1.2 XTC/3 Safety
    • 1.2.1 Definition of Notes, Cautions and Warnings
    • 1.2.2 General Safety Information
    • 1.2.3 Earth Ground
    • 1.2.4 Main Power Connection
  • 1.3 How to Contact INFICON
    • 1.3.1 Returning Sensor to INFICON
  • 1.4 XTC/3 Specifications
    • 1.4.1 Measurement
    • 1.4.2 Screens and Parameters
    • 1.4.3 Process Recipe Storage
      • 1.4.3.1 Film Parameters
    • 1.4.4 Display
    • 1.4.5 Source / Recorder Outputs
    • 1.4.6 Relays / Inputs
    • 1.4.7 Remote Communications
    • 1.4.8 Accessories
    • 1.4.9 Power
    • 1.4.10 Operating Environment
    • 1.4.11 Storage Temperature
    • 1.4.12 Warm Up Period
    • 1.4.13 Size
    • 1.4.14 Connector Clearance Requirements
    • 1.4.15 Weight
    • 1.4.16 Cleaning
  • 1.5 Unpacking and Inspection
  • 1.6 Parts and Options Overview
    • 1.6.1 Base Configurations
    • 1.6.2 Accessories
    • 1.6.3 Replacement Cables & Oscillators
    • 1.6.4 Sensors
  • 1.7 Initial Power On Verification
• Chapter 2 Installation and Interfaces
  • 2.1 Location Guidelines
    • 2.1.1 Sensor Types
    • 2.1.2 Sensor Installation
    • 2.1.3 XTC/3 Installation
  • 2.2 Avoiding Electrical Interference
    • 2.2.1 Verifying/Establishing Earth Ground
    • 2.2.2 Connections to Earth Ground
    • 2.2.3 Minimizing Noise Pickup From External Cabling
  • 2.3 Connecting the Controller
    • 2.3.1 Verifying the Correct Input Voltage
    • 2.3.2 Routing Oscillator (XIU) Cables
    • 2.3.3 Interface Cable Fabrication and Pin-Out
      • 2.3.3.1 Source Control Connection
      • 2.3.3.2 Input and Output Connections
        • 2.3.3.2.1 System I/O Connector
        • 2.3.3.2.2 Aux I/O Connector
        • 2.3.3.2.3 Inputs
    • 2.3.4 RS-232C Communications
    • 2.3.5 TCP/IP Communications Connection (Optional)
      • 2.3.5.1 Network Connection
      • 2.3.5.2 Change the IP Address in XTC/3
      • 2.3.5.3 PC Setup
• Chapter 3 Operation
  • 3.1 Front Panel Controls
  • 3.2 Rear Panel Interfaces
  • 3.3 Displays
    • 3.3.1 Menu Display
    • 3.3.2 Operate Display
      • 3.3.2.1 Crystal Life and Starting Frequency
      • 3.3.2.2 Choosing The Right Crystal
      • 3.3.2.3 Percent Life Auto-Zero
    • 3.3.3 Film Name Display
    • 3.3.4 Process List Display (XTC/3M only)
    • 3.3.5 General Parameter Display
    • 3.3.6 I/O Map Display
    • 3.3.7 Diagnostics Display
    • 3.3.8 Sensor Information Display
  • 3.4 Executing a Process
  • 3.5 State Descriptions
    • 3.5.1 Alarms and Stops
      • 3.5.1.1 Alarms
      • 3.5.1.2 Stops
      • 3.5.1.3 Recovering from STOP
  • 3.6 Special Features
    • 3.6.1 Automating a Process
    • 3.6.2 Ion Assisted Deposition
    • 3.6.3 Control Delay
    • 3.6.4 Shutter Delay
    • 3.6.5 Rate Ramp Trigger of Final Thickness
    • 3.6.6 Transfer Sensor
    • 3.6.7 Crucible Switching
      • 3.6.7.1 Bin mode
      • 3.6.7.2 BCD mode (XTC/3M only)
    • 3.6.8 Crystal Switching
      • 3.6.8.1 CrystalTwo
      • 3.6.8.2 CrystalSix
      • 3.6.8.3 Crystal12
      • 3.6.8.4 Rotary Sensor Crystal Switching
      • 3.6.8.5 Dual Head
      • 3.6.8.6 XTC/3S Sensor Shutter / CrystalSwitch Output
    • 3.6.9 Start Layer Without Backup Crystal Configuration
    • 3.6.10 RateWatcher
    • 3.6.11 Hand-held Controller (Option)
    • 3.6.12 Lock Code
    • 3.6.13 Parameter Clear
    • 3.6.14 Datalog
    • 3.6.15 TCP/IP
• Chapter 4 XTC/3 Programming
  • 4.1 Overview
  • 4.2 Film Set Up Overview
    • 4.2.1 Film Set Up
    • 4.2.2 Film Definition
    • 4.2.3 Film Definition Parameters
      • 4.2.3.1 Pre/Post Deposition Parameters
      • 4.2.3.2 Deposit
      • 4.2.3.3 Sensor Parameters
        • 4.2.3.3.1 Setting S&Q Parameters (Soft Crystal Failures)
        • 4.2.3.3.2 Stability
        • 4.2.3.3.3 Quality
      • 4.2.3.4 Source Parameters
      • 4.2.3.5 Option
  • 4.3 Process Set-Up Overview (XTC/3M only)
    • 4.3.1 Process Definition
      • 4.3.1.1 Process Number
      • 4.3.1.2 Process Name
      • 4.3.1.3 Building the Layer Sequence
  • 4.4 General Parameters
    • 4.4.1 Process Parameters
    • 4.4.2 Hardware Parameters
      • 4.4.2.1 XTC/3S Film Select Option
    • 4.4.3 Comm Info
      • 4.4.3.1 Remote Communication Parameters
  • 4.5 I/O Overview
    • 4.5.1 XTC/3S Inputs and Outputs
    • 4.5.2 XTC/3M Inputs
    • 4.5.3 XTC/3M Outputs
    • 4.5.4 Clear Input or Output
• Chapter 5 Remote Communications
  • 5.1 Remote Communications Overview
    • 5.1.1 Message Protocols
    • 5.1.2 Physical Connections
    • 5.1.3 RS-232C Serial Port
    • 5.1.4 TCP/IP Ethernet Port
      • 5.1.4.1 Network Connection
      • 5.1.4.2 How to Set Up the Network Protocol on the PC
  • 5.2 Standard Protocol Message Format
    • 5.2.1 Standard Protocol
      • 5.2.1.1 Standard Command Packet (Host to XTC/3 Message)
      • 5.2.1.2 Standard Response Packet (XTC/3 to Host Message)
    • 5.2.2 Standard Communication Commands
      • 5.2.2.1 Standard ECHO Command
      • 5.2.2.2 Standard HELLO Command
      • 5.2.2.3 Standard QUERY Commands
        • 5.2.2.3.1 Query Block
        • 5.2.2.3.2 Standard Query Film Name (XTC3/M only)
        • 5.2.2.3.3 Standard Query Film Parameters
        • 5.2.2.3.4 Standard Query General Parameter
        • 5.2.2.3.5 Standard Query Input Definition (XTC/3M Only)
        • 5.2.2.3.6 Standard Query Output Definition (XTC/3M Only)
        • 5.2.2.3.7 Standard Query Output Type Definition (XTC/3M Only)
        • 5.2.2.3.8 Standard Query Process Parameters (XTC/3M Only)
      • 5.2.2.4 Standard UPDATE Commands
        • 5.2.2.4.1 Update Block
        • 5.2.2.4.2 Standard Update Film Name (XTC/3M only)
        • 5.2.2.4.3 Standard Update Film Parameters
        • 5.2.2.4.4 Standard Update General Parameters
        • 5.2.2.4.5 Standard Update Input Definition (XTC/3M only)
        • 5.2.2.4.6 Standard Update Output Definition (XTC/3M only)
        • 5.2.2.4.7 Standard Update Output Type Definition (XTC/3M Only)
        • 5.2.2.4.8 Standard Update Process Parameters (XTC/3M only)
      • 5.2.2.5 Standard STATUS Commands
      • 5.2.2.6 Standard REMOTE Commands
  • 5.3 XTC/2 Protocols
    • 5.3.1 Basic Command Structure
    • 5.3.2 XTC/2 Serial Communication with Checksum
    • 5.3.3 XTC/2 Serial Communications - No Checksum
    • 5.3.4 XTC/2 Error Codes
    • 5.3.5 XTC/2 Message Strings
      • 5.3.5.1 XTC/2 ECHO Command
      • 5.3.5.2 XTC/2 HELLO Command
      • 5.3.5.3 XTC/2 QUERY Command
      • 5.3.5.4 XTC/2 UPDATE Command
      • 5.3.5.5 XTC/2 STATUS Command
      • 5.3.5.6 XTC/2 REMOTE Commands
      • 5.3.5.7 XTC/2 Sample Host Programs
        • 5.3.5.7.1 XTC/2 Program Without Checksum
        • 5.3.5.7.2 XTC/2 Program With Checksum
• Chapter 6 Troubleshooting, Status and Error Messages
  • 6.1 Status and Error Messages
  • 6.2 XTC/3 Diagnostics
  • 6.3 Troubleshooting Guide
    • 6.3.1 Troubleshooting XTC/3
    • 6.3.2 Troubleshooting Transducers/Sensors
      • 6.3.2.1 Verifying Crystal Switching and Rotation
      • 6.3.2.2 Verifying Sensor Shutter Operation
    • 6.3.3 Troubleshooting Computer Communications
      • 6.3.3.1 TCP/IP Module LED Diagnostics
  • 6.4 Replacing the Crystal
    • 6.4.1 Front Load Single Sensors
    • 6.4.2 Shuttered Front Load Single and Front Load Dual Sensors
    • 6.4.3 Cool Drawer Sensor
    • 6.4.4 Bakeable Sensor
    • 6.4.5 Sputtering Sensor
    • 6.4.6 Crystal Snatcher
    • 6.4.7 CrystalSix
    • 6.4.8 Crystal12
  • 6.5 Crystal Sensor Emulator PN 760-601-G2
    • 6.5.1 Diagnostic Procedures
      • 6.5.1.1 Measurement System Diagnostic Procedure
      • 6.5.1.2 Feed-Through Or In-Vacuum Cable Diagnostic Procedure
      • 6.5.1.3 Sensor Head Or Monitor Crystal Diagnostic Procedure
      • 6.5.1.4 System Diagnostics Pass But Crystal Fail Message Remains
    • 6.5.2 % XTAL Life
    • 6.5.3 Sensor Cover Connection
      • 6.5.3.1 Compatible Sensor Heads
      • 6.5.3.2 Incompatible Sensor Heads
    • 6.5.4 Specifications
• Chapter 7 Calibration Procedures
  • 7.1 Importance of Density, Tooling and Z-Ratio
  • 7.2 Determining Density
  • 7.3 Determining Tooling
  • 7.4 Laboratory Determination of Z-Ratio
  • 7.5 Estimating Z-Ratio
• Chapter 8 Measurement and Control Theory
  • 8.1 Basics
    • 8.1.1 Monitor Crystals
    • 8.1.2 Period Measurement Technique
    • 8.1.3 Z-Match Technique
    • 8.1.4 Active Oscillator
    • 8.1.5 ModeLock Oscillator
    • 8.1.6 Control Loop Theory
• Chapter A Material Table