Rockwell Automation 1746-NT4 Series B,D17466.6.1 SLC 500 4-Channel Thermocouple/mV Input Module User Manual - Manual (Page 30)

Publication 1746-UM007C-EN-P - July 2004
3-2 Installation and Wiring
Electrostatic Discharge Electrostatic discharge can damage semiconductor devices inside this
module if you touch backplane connector pins. Guard against
electrostatic damage by observing the precautions listed next.
•
W ear an approved wrist strap grounding device when handling
the module.
•
T ouch a grounded object to rid yourself of electrostatic charge
before handling the module.
•
H andle the module from the front, away from the backplane
connector. Do not touch backplane connector pins.
•
K eep the module in its static-shield bag when not in use, or
during shipment.
NT4 Power Requirements The thermocouple module receives its power through the SLC500
chassis backplane from the fixed or modular +5 VDC/+24 VDC chassis
power supply. The maximum current drawn by the module is shown
in the table below.
When you are using a modular system configuration, add the values
shown in the table above to the requirements of all other modules in
the SLC chassis to prevent overloading the chassis power supply.
When you are using a fixed system controller, refer to the important
note about module compatibility in a 2-slot expansion chassis on page
3-3.
ATTENTION
Electrostatic discharge can degrade performance or
cause permanent damage. Handle the module as
stated below.
5V dc Amps 24V dc Amps
0.06 0.04