Rockwell Automation 1746-NT4 Series B,D17466.6.1 SLC 500 4-Channel Thermocouple/mV Input Module User Manual - Manual (Page 31)

Publication 1746-UM007C-EN-P - July 2004
Installation and Wiring 3-3
Module Location in Chassis Place your thermocouple module in any slot of an SLC 500 modular,
or modular expansion chassis, except for the extreme left slot (slot 0)
in the first chassis. This slot is reserved for the processor or adapter.
Fixed Expansion Chassis Considerations
In the table:
•
AN "x" indicates a valid combination.
•
No symbol indicates an invalid combination.
•
A "+" indicates an external power supply (refer to the SLC 500
4-Channel Analog I/O Modules User Manual, publication
1746-UM005 for more information).
When using the table, be aware that there are certain conditions that
affect the compatibility characteristics of the BASIC module (BAS) and
the DH-485/RS-232C module (KE).
When you use the BAS module or the KE module to supply power to
a 1747-AIC Link Coupler, the Link Coupler draws its power through
the module. The higher current drawn by the AIC at 24 VDC is
calculated and recorded in the table for the modules identified as
BASn (BAS networked) or KEn (KE networked). Make sure to refer to
these modules if your application uses the BAS or KE module in this
way.
IMPORTANT
The 2-slot, SLC 500 fixed I/O expansion chassis
(1746-A2) will support only specific combinations of
modules. If you are using the thermocouple module
in a 2-slot expansion chassis with another SLC I/O or
communication module, refer to the table starting
below to determine whether the combination can be
supported.
1746- NT4 5V dc Amps 24V dc Amps
IA4 x 0.035 N/A
IA8 x 0.050 N/A
IA16 x 0.085 N/A
IM4 x 0.035 N/A
IM8 x 0.050 N/A