Kontron CG2100 Carrier Grade Server - Manual (Page 32)

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• If only one processor socket is populated, the next upgrade from the Single Channel
mode is installing DIMM B1 to allow channel interleaving. The system operates in the
Independent Channel mode.
• The DIMM parameter-matching requirements for memory RAS is local to a socket. For
example, while Channels A/B/C can have one match of timing, technology, and size,
channels D/E/F can have a different set of parameters and RAS still functions.
• DDR3 DIMMs on adjacent slots on the same channel do not need to be identical.
• For the Mirrored Channel mode, the memory in channels A and B of socket 1 must be
identical and channel C should be empty. Similarly, the memory in Channels D and E
of Socket 2 must be identical and Channel F should be empty.
a. The minimum population upgrade for the Mirrored Channel mode is DIMM A1, DIMM
B1, DIMM D1, and DIMM E1 with both processor sockets populated. DIMM A1 and DIMM
B1 as a pair must be identical, and so must DIMM D1 and DIMM E1, but the DIMMs
on different processor sockets do not need to be identical.
Failure to comply with these rules results in a switch back to Independent
Channel mode.
b. If Mirrored Channel mode is selected and the third channel of each processor
socket is not empty, the BIOS disables the memory in the third channel of each
processor socket.
•
In the Mirrored Channel mode, both sockets must simultaneously satisfy the DIMM
matching rules on their respective adjacent channels. If the DDR3 DIMMs on adjacent
channels of a socket are not identical, the BIOS configures both the processor
sockets to default to the Independent Channel mode. If DIMM D1 and DIMM E1 are not
identical, then the system switches to the Independent Channel Mode.
Installing Memory DIMMs
NOTE: To reduce the risk of electrostatic discharge (ESD) damage to the processor or
the DIMM, be sure to follow these procedures:
1. Touch the metal chassis before touching the DIMM or server board.
2. Keep part of your body in contact with the metal chassis to dissipate the static
charge while handling the DIMM.
3. Avoid moving around unnecessarily.
4. Use a ground strap attached to the front panel (with the bezel removed).
To install DIMMs in the T5520UR server board slots, follow these steps:
1. Remove the back chassis cover. For instructions see “Removing the Back Cover”.
2. Remove the riser card assembly (so the processor air duct can be removed). For
instructions see “Removing the Riser Card Assembly”.
3. Remove the processor air duct. For instructions, see “Removing the Processor Air
Duct”.
4. Locate the DIMM slots you want to use, depending on which processor the memory is
for. See Figure 7 and Figure 15.
If you are replacing an installed DIMM rather than installing one in an empty slot,
see “Replacing or Removing Memory DIMMs” for instructions and then return to step 5
here.
5. Open both DIMM slot levers. (Figure 15, “A”)
6. Note the location of the alignment notch. (“B”)
7. Insert the DIMM, making sure the connector edge of the DIMM aligns correctly with
slot. (“E”)
8. Using both hands, push down firmly and evenly on both sides of the DIMM until it
snaps into place and the levers close.
(“C” and “D”)