INFICON MDC-360 Thin Film Deposition Controller User Manual

Page 7

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8.3.2

VOLTAGE SELECTION ............................................................................................ 8-1

8.3.3

GROUND LUG.......................................................................................................... 8-2

8.3.4

REMOTE POWER HANDSET................................................................................... 8-2

8.3.5

SOURCE-SENSOR .................................................................................................... 8-2

8.3.6

RS-232 COMMUNICATION...................................................................................... 8-2

8.3.7

DISCRETE INPUT/OUTPUT .................................................................................... 8-3

8.3.8

DIGITAL-TO-ANALOG CONVERTER (DAC) .......................................................... 8-3

9.

SYSTEM INSTALLATION ............................................................................................. 9-1

9.1

SENSOR HEAD DESCRIPTION .................................................................................. 9-1

9.2

SENSOR HEAD INSTALLATION ............................................................................... 9-1

9.3

SENSOR OSCILLATOR ............................................................................................... 9-2

9.3.1

INSTALLATION......................................................................................................... 9-2

9.4

INSTRUMENTATION FEEDTHROUGH.................................................................... 9-2

9.5

SENSOR CRYSTAL REPLACEMENT ........................................................................ 9-2

9.6

TYPICAL SYSTEM INSTALLATION......................................................................... 9-3

10.

THEORY OF OPERATION ......................................................................................10-1

10.1

BASIC MEASUREMENT ............................................................................................10-1

10.2

FILM THICKNESS CALCULATION..........................................................................10-1

10.3

CRYSTAL HEALTH CALCULATION .......................................................................10-3

10.4

RATE CALCULATION................................................................................................10-4

10.5

RATE CONTROL .........................................................................................................10-4

10.6

EMPIRICAL CALIBRATION......................................................................................10-4

10.6.1

FILM DENSITY....................................................................................................10-4

10.6.2

TOOLING FACTOR.............................................................................................10-5

10.6.3

ACOUSTIC IMPEDANCE ...................................................................................10-5

11.

COMPUTER INTERFACE........................................................................................11-1

11.1

GENERAL.....................................................................................................................11-1

11.2

RS-232 SERIAL INTERFACE .....................................................................................11-1

11.3

RS-485 SERIAL INTERFACE .....................................................................................11-1

11.4

IEEE-488 PARALLEL INTERFACE ...........................................................................11-2

11.5

PROTOCOL ..................................................................................................................11-2

11.6

DATA TYPES ...............................................................................................................11-3

11.7

MESSAGE RECEIVED STATUS ................................................................................11-3

11.8

INSTRUCTION SUMMARY .......................................................................................11-4

11.9

INSTRUCTION DESCRIPTIONS................................................................................11-5

12.

REPAIR AND MAINTENANCE...............................................................................12-1

12.1

HANDLING PRECAUTIONS......................................................................................12-1

12.2

MAINTENANCE PHILOSOPHY ................................................................................12-1

12.3

TROUBLE SHOOTING AIDS .....................................................................................12-2

12.4

RETURNING THE MDC-360 TO THE FACTORY....................................................12-3

13.

APPENDIX A...............................................................................................................13-1

14.

APPENDIX B – PARAMETER TEMPLATES ........................................................14-2

14.1

MATERIAL...................................................................................................................14-3

14.2

PROCESS......................................................................................................................14-5

14.3

DISPLAY SETUP .........................................................................................................14-6

14.4

INPUTS .........................................................................................................................14-7

14.5

OUTPUTS .....................................................................................................................14-8

14.6

ACTIONS ......................................................................................................................14-9

14.7

SENSOR SETUP.........................................................................................................14-10

14.8

SOURCE SETUP ........................................................................................................14-10

14.9

DAC SETUP................................................................................................................14-11

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