Rockwell Automation 8720MC High Performance Drives Installation Manual - Manual (Page 24)

Publication 8720MC-IN001D-EN-P — December 2002
1-12 Installing Your 8720MC Drive
HF Bonding Your System Bonding is the practice of connecting metal chassis, assemblies,
frames, shields and enclosures to reduce the effects of electromagnetic
interference (EMI). For more information on the concept of
high-frequency (HF) bonding, the ground plane principle, and
electrical noise reduction, refer to System Design for Control of
Electrical Noise (publication GMC-RM001x-EN-P).
Bonding Modules
Unless specified, most paints are not conductive and they act as
insulators. To achieve a good bond between the drive and the
subpanel, surfaces need to be paint-free or plated. Bonding metal
surfaces creates a low-impedance return path for high-frequency
energy.
Improper bonding blocks the direct return path and allows
high-frequency energy to travel elsewhere in the cabinet. Excessive
high-frequency energy can effect the operation of other
microprocessor controlled equipment.
IMPORTANT
To improve the bond between the drive and
subpanel, construct your subpanel out of zinc plated
(paint-free) steel.