Rockwell Automation AADvance Controller System Build - Manual (Page 32)

2-2 Document: 553632
(ICSTT-RM448_EN_P) Issue: 08:
System Build Manual (AADvance Controller)
Test Equipment Test Equipment Test Equipment Test Equipment
The assembly of the system does not require the use of test-equipment, however, the
preparation for initial switch on and start up may require the use of a multimeter.
An engineering workstation running the Workbench programming software will be
needed for communicating with the system, downloading the application software and
for monitoring system variables and application logic.
System Installation Environment System Installation Environment System Installation Environment System Installation Environment
The installation environment is a potential source of common cause failure, therefore
it is vital that compatibility of the equipment with the environment is known. The
environment for these purposes includes the prevailing climatic, hazardous area,
power, earthing and EMC conditions. In many cases, there will not be a single
installation environment. Elements of the system may be installed in differing locations;
in these cases, it is important to know the environment for each location.
Specifying an Enclosure Specifying an Enclosure Specifying an Enclosure Specifying an Enclosure
An enclosure for a controller must be designed for the environmental conditions
where the controller is installed. It needs to support the weight of the controller
modules, provide mechanical protection and remove the heat that the controller
generates. The enclosure must also be able to hold the modules securely and should
not interfere with any components.
Maximum Enclosure Air temperature Maximum Enclosure Air temperature Maximum Enclosure Air temperature Maximum Enclosure Air temperature
The maximum air temperature rating in an enclosure where standard AADvance
processor and I/O modules are installed to ensure predictable reliability is 70 ºC (140
°F).
CAUTION HEAT DISSIPATION AND ENCLOSURE POSITION
System and field power consumption by modules and termination assemblies is
dissipated as heat. You should consider this heat dissipation on the design and
positioning of your enclosure; e.g. enclosures exposed to continuous sunlight
will have a higher internal temperature that could affect the operating
temperature of the modules. Modules operating at the extremes of the
temperature band for a continuous period can have a reduced reliability.