Document Outline

• Contents
• 1. INTRODUCTION
  • 1.1 Using the MagneticFlowmeter Safely
  • 1.2 Warranty
  • 1.3 ATEX Documentation
• 2. HANDLING PRECAUTIONS
  • 2.1 Checking Model andSpecifications
  • 2.2 Accessories
  • 2.3 Storage Precautions
  • 2.4 Installation LocationPrecautions
• 3. INSTALLATION
  • 3.1 Piping Design Precautions
  • 3.2 Handling Precautions
    • 3.2.1 General Precautions
    • 3.2.2 Flowmeter Piping
  • 3.3 Mounting Procedures
    • 3.3.1 Nominal Diameter 25 mm (1.0 in.) to40 mm (1.5 in.), Wafer Type
    • 3.3.2 Nominal Diameter 50 mm (2.0 in.) to200 mm (8.0 in.), Wafer Type
    • 3.3.3 Nominal Diameter 25 mm (1.0 in.) to200 mm (8.0 in.), Flange Type
• 4. WIRING
  • 4.1 Wiring Precautions
  • 4.2 Terminal Configuration andTerminal Wiring
  • 4.3 Wiring Ports
  • 4.4 Grounding Connection
  • 4.5 Wiring Connections
  • 4.6 Wiring Procedure
• 5. BASIC OPERATING PROCEDURES (USING THE DISPLAY UNIT)
  • 5.1 Operating PanelConfiguration and Functions
  • 5.2 Display Unit Setting Methods
    • 5.2.1 Display Mode → Setting Mode
    • 5.2.2 Setting Mode
  • 5.3 Parameter Setting Procedure
    • 5.3.1 Setting Example for Selection-Type Data: Flow rate units
    • 5.3.2 Setting Example for Numeric-Type Data: Flow rate span
    • 5.3.3 Setting Example for Alphanumeric-Type Data: Tag number
• 6. PARAMETER DESCRIPTION
  • 6.1 Parameters
  • 6.2 Parameter Lists
  • 6.3 Parameter List Overview
  • 6.4 Parameter Description
  • 6.5 Alarm Functions
    • 6.5.1 Alarm Levels
    • 6.5.2 Alarm Selection
    • 6.5.3 Alarms & Warning Messages
    • 6.5.4 NE-107 status
• 7. OPERATION VIA BRAIN TERMINAL (BT200)
  • 7.1 BT200 Basic Operations
    • 7.1.1 Key Layout and Display
    • 7.1.2 Key Descriptions
  • 7.2 AXR Operation Using aBT200
    • 7.2.1 BT200 Connection
    • 7.2.2 The data update and upload/download function of BT200
    • 7.2.3 BT200 Screens & Flow Rate DataDisplay
  • 7.3 Parameter Setting Using aBT200
    • 7.3.1 BT200 Setting of Selection-Type Data: Flow rate units
    • 7.3.2 BT200 Setting of Numeric-Type Data: Flow rate span
    • 7.3.3 BT200 Setting of Alphanumeric-Type Data: Tag number
• 8. OPERATION VIA HART CONFIGURATION TOOL (HART 5)
  • 8.1 HART Protocol Revision
  • 8.2 Device Description (DD) ona HART Configuration Tooland AXR Device Revision
    • 8.2.1 DD Revision and Device Revision
    • 8.2.2 Device Type Manager (DTM) andDevice Revision
  • 8.3 Interconnection between AXR and HART Configuration Tool
  • 8.4 Basic Setup
  • 8.5 Parameters Configuration
  • 8.6 Data Renewing
  • 8.7 Self-diagnostic Functions
  • 8.8 HART Specific Functions
    • 8.8.1 Trim Analog Output
    • 8.8.2 Fixed Current Output
    • 8.8.3 Burst Mode
    • 8.8.4 Multidrop Mode
    • 8.8.5 Switching HART Protocol Revision
    • 8.8.6 Other operations for the HARTconfiguration tool
  • 8.9 Menu Tree for DD (HART 5)
  • 8.10 Menu Tree for DTM (HART 5)
• 9. OPERATION VIA HART CONFIGURATION TOOL (HART 7)
  • 9.1 HART Protocol Revision
  • 9.2 Device Description (DD) ona HART Configuration Tooland AXR Device Revision
    • 9.2.1 DD Revision and Device Revision
    • 9.2.2 Device Type Manager (DTM) andDevice Revision
  • 9.3 Interconnection between AXR and HART Configuration Tool
  • 9.4 Basic Setup
  • 9.5 Parameters Configuration
  • 9.6 Data Renewing
  • 9.7 Self-diagnostic Functions
  • 9.8 HART Specific Functions
    • 9.8.1 Test Output, Simulation, and Squawk
    • 9.8.2 Trim Analog Output
    • 9.8.3 Burst Mode
    • 9.8.4 Multidrop Mode
    • 9.8.5 Switching HART Protocol Revision
    • 9.8.6 Other operations for the HARTconfiguration tool
  • 9.9 Menu Tree for DD and DTM (HART 7)
• 10. ACTUAL OPERATION
  • 10.1 Pre-operation ZeroAdjustment
    • 10.1.1 Zero Adjustment Using Display Unit Switches
• 11. MAINTENANCE
  • 11.1 Changing Direction ofElectrical Connection
    • 11.1.1 Changing Direction of ElectricalConnection
  • 11.2 Components Replacement
    • 11.2.1 Display Unit Replacement
    • 11.2.2 Amplifier Replacement
  • 11.3 Setting of Switches
    • 11.3.1 Setting of Burnout Switch
    • 11.3.2 Setting of Write Protect Switch
  • 11.4 Adhesion diagnosticfunction
    • 11.4.1 Adhesion Diagnostic Using Display Unit Switches
  • 11.5 Regular Inspection Items
  • 11.6 Insulation Resistance Test,Dielectric Strength Test
    • 11.6.1 Procedure of Insulation Resistance test
    • 11.6.2 Procedure of Dielectric Strength Test
  • 11.7 Troubleshooting
    • 11.7.1 No Indication
    • 11.7.2 Unstable Zero
    • 11.7.3 Disagreement Between Indication and Actual Flow
• 12. OUTLINE
  • STANDARD SPECIFICATIONS
  • HAZARDOUS AREA CLASSIFICATION
  • STANDARD PERFORMANCE
  • NORMAL OPERATING CONDITIONS
  • MODEL AND SUFFIX CODE
  • OPTIONAL SPECIFICATIONS
  • EXTERNAL DIMENSIONS
  • SIZING DATA (Measurable flow velocity is from 0 m/s.)
• 13. PED (PRESSURE EQUIPMENT DIRECTIVE)
• 14. EXPLOSION PROTECTED TYPEINSTRUMENT
  • 14.1 ATEX
  • 14.2 FM
  • 14.3 IECEx
  • 14.4 TIIS
• Appendix 1. Safety Instrumented SystemsInstallation
  • A1.1 Scope and Purpose
  • A1.2 Using the AXR for an SISApplication
    • A1.2.1 Safety Accuracy
    • A1.2.2 Diagnostic Response Time
    • A1.2.3 Setup
    • A1.2.4 Required Parameter Settings
    • A1.2.5 Proof Testing
    • A1.2.6 Repair and Replacement
    • A1.2.7 Startup Time
    • A1.2.8 Firmware Update
    • A1.2.9 Reliability Data
    • A1.2.10 Lifetime Limits
    • A1.2.11 Environmental Limits
    • A1.2.12 Application Limits
  • A1.3 Definitions andAbbreviations
    • A1.3.1 Definitions
    • A1.3.2 Abbreviations
• INSTALLATION AND OPERATING PRECAUTIONSFOR TIIS FLAMEPROOF EQUIPMENT
  • Apparatus Certified Under Technical Criteria(IEC-compatible Standards)
  • 1. General
  • 2. Electrical Apparatus ofFlameproof Type of Explosion-Protected Construction
  • 3. Terminology
  • 4. Installation of FlameproofApparatus
  • 5. External Wiring forFlameproof Apparatus
  • 6. Maintenance of FlameproofApparatus
  • 7. Selection of Cable EntryDevices for Flameproof Type
• Revision Information