INFICON IQM-233 Thin Film Deposition Controller PCI-Express Card Operating Manual - Manual (Page 107)

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IQM-233 Operating Manual
CeO
2
7.130 *1.000 cerium (iv) dioxide
Co 8.900 0.343 cobalt
CoO 6.440 0.412 cobalt oxide
Cr 7.200 0.305 chromium
Cr
2
O
3
5.210 *1.000 chromium (iii) oxide
Cr
3
C
2
6.680 *1.000 chromium carbide
CrB 6.170 *1.000 chromium boride
Cs 1.870 *1.000 cesium
Cs
2
SO
4
4.243 1.212 cesium sulfate
CsBr 4.456 1.410 cesium bromide
CsCI 3.988 1.399 cesium chloride
CsI 4.516 1.542 cesium iodide
Cu 8.930 0.437 copper
Cu
2
O 6.000 *1.000 copper oxide
Cu
2
S 5.600 0.690 copper (i) sulfide (alpha)
Cu
2
S 5.800 0.670 copper (i) sulfide (beta)
CuS 4.600 0.820 copper (ii) sulfide
Dy 8.550 0.600 dysprosium
Dy
2
O
3
7.810 *1.000 dysprosium oxide
Er 9.050 0.740 erbium
Er
2
O
3
8.640 *1.000 erbium oxide
Eu 5.260 *1.000 europium
EuF
2
6.500 *1.000 europium fluoride
Fe 7.860 0.349 iron
Fe
2
O
3
5.240 *1.000 iron oxide
FeO 5.700 *1.000 iron oxide
FeS 4.840 *1.000 iron sulphide
Ga 5.930 0.593 gallium
Ga
2
O
3
5.880 *1.000 gallium oxide (b)
GaAs 5.310 1.590 gallium arsenide
GaN 6.100 *1.000 gallium nitride
GaP 4.100 *1.000 gallium phosphide
GaSb 5.600 *1.000 gallium antimonide
Table A-1 Material table (continued)
Formula Density Z-Ratio Material Name