INFICON IQM-233 Thin Film Deposition Controller PCI-Express Card Operating Manual - Manual (Page 82)

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IQM-233 Operating Manual
Thickness reading has
large excursions during
source warm-up or when
source shutter is opened
(usually causes Thickness
reading to decrease) and
after the termination of
deposition (usually causes
Thickness reading to
increase). Excessive heat input to the
crystal. If heat is due to radiation
from the evaporation source,
move sensor farther away (at
least 25.4 cm (10 in.)) from
source.
Use SPC-1157-G10 thermal
shock crystals designed to
minimize frequency shifts
due to heat load.
Inadequate cooling of crystal. Check water flow rate and
temperature for sensor
cooling.
Crystal is being heated by
electron flux. Use a sputtering sensor for
non-magnetron sputtering.
Crystal is being hit by small
droplets of molten material
from the evaporation source. Use a shutter to shield the
sensor during source
conditioning.
Move the crystal farther away
(at least 25.4 cm (10 in.))
from the source.
Intermittent connection
occurring in sensor or
feedthrough with thermal
variation. Use an ohmmeter to check
electrical continuity / isolation
of sensor head, feedthrough,
and in-vacuum cable. Refer
to the sensor’s operating
manual for detailed
troubleshooting information.
Table 5-1 Symptom/Cause/Remedy Chart (continued)
SYMPTOM CAUSE REMEDY