Document Outline

• Cover Page
• Title Page
• Trademarks
• Declaration Of Conformity
• Registration Card
• Warranty
• Table Of Contents
• Chapter 1 Introduction and Specifications
  • 1.1 Instrument Safety
    • 1.1.1 Notes, Cautions, Warnings
    • 1.1.2 General Safety Information
    • 1.1.3 Earth Ground
    • 1.1.4 Main Power Connection
  • 1.2 Introduction to the Instrument
  • 1.3 Specifications
    • 1.3.1 Specifications XTC/2 and XTC/C
      • 1.3.1.1 General
      • 1.3.1.2 Measurement
      • 1.3.1.3 Source Controls
      • 1.3.1.4 Input/Output
      • 1.3.1.5 Recorder Output
      • 1.3.1.6 Display
      • 1.3.1.7 Process Recipe Storage
      • 1.3.1.8 Hardware interface
      • 1.3.1.9 Operation
    • 1.3.2 Transducer Specifications (optional)
    • 1.3.3 XIU (Crystal Interface Unit) Specifications
  • 1.4 Guide to the Use of the Manual
  • 1.5 XTC/C Users and Installers Note
  • 1.6 Related Manuals
  • 1.7 How To Contact Customer Support
    • 1.7.1 Application Support
    • 1.7.2 Field Service and Repair Support
    • 1.7.3 Returning Your Instrument
• Chapter 2 Quick Use Guide
  • 2.1 Unpacking, Initial Inspection and Inventory
    • 2.1.1 Unpacking and Inspection Procedures
    • 2.1.2 Inventory
      • 2.1.2.1 XTC/2 System Configuration
      • 2.1.2.2 XTC/C System Configuration
      • 2.1.2.3 Ship Kit - XTC/2 XTC/C
  • 2.2 Voltage Selection
  • 2.3 Installation Guide and Schematic
  • 2.4 XTC/2 Front Panel Description
    • 2.4.1 XTC/2 Front Control Panel Description
    • 2.4.2 XTC/2 Display Description
  • 2.5 XTC/C Front Panel Description
  • 2.6 Rear Panel Description
    • 2.6.1 Power Module
    • 2.6.2 Configuration Switches 1 & 2
    • 2.6.3 Grounding Stud
    • 2.6.4 System I/O
    • 2.6.5 AUX I/O
    • 2.6.6 Sensor 1, Sensor 2
    • 2.6.7 RS232
    • 2.6.8 Communication Option
    • 2.6.9 Source 1,2
    • 2.6.10 Manufacturer’s Identification and Serial Number Plate
    • 2.6.11 Recorder
  • 2.7 Operation as a Deposition Monitor
    • 2.7.1 Monitoring - Systems Without a Source Shutter
    • 2.7.2 Monitoring - Systems with a Source Shutter
    • 2.7.3 Rate Sampling
    • 2.7.4 Nontraditional Applications
      • 2.7.4.1 Etching
      • 2.7.4.2 Immersion in Liquids
      • 2.7.4.3 Biological
      • 2.7.4.4 Measurement of Liquids
  • 2.8 Operation as a One Layer Controller
    • 2.8.1 Skipping a State Overview
    • 2.8.2 Idle State Processing Overview
    • 2.8.3 Manual Power Overview
    • 2.8.4 Time Power State Overview
    • 2.8.5 Controlling the Source Overview
  • 2.9 Operation as a Multi-Layer Controller
    • 2.9.1 Defining a Process Overview
• Chapter 3 Installation
  • 3.1 Installing the Instrument - Details
    • 3.1.1 Control Unit Installation
  • 3.2 Electrical Grounding and Shielding Requirements
    • 3.2.1 Verifying / Establishing Earth Ground
    • 3.2.2 Connections to Earth Ground
    • 3.2.3 Minimizing Noise Pickup from External Cabling
  • 3.3 Connection to Rear Panel
    • 3.3.1 The BNC Connectors
    • 3.3.2 The "D" Shell Connectors
  • 3.4 Sensor Selection Guide
  • 3.5 Guidelines for Transducer Installation
    • 3.5.1 Sensor Installation
    • 3.5.2 CrystalSix
    • 3.5.3 Check List for Transducer Installation
  • 3.6 Use of the Test Mode (XTC/2 Only)
    • 3.6.1 Operational Test
  • 3.7 Input and Output Details
    • 3.7.1 Relays
    • 3.7.2 Inputs
    • 3.7.3 Chart Recorder
    • 3.7.4 Source Outputs
  • 3.8 Computer Communications
    • 3.8.1 Communications Setup
      • 3.8.1.1 IEEE Settings for a National Instruments IEEE-GPIB Board
    • 3.8.2 Basic Command Structure
    • 3.8.3 Service Requests and Message Available
    • 3.8.4 Datalogging
    • 3.8.5 Computer Command Details
      • 3.8.5.1 Echo Command
      • 3.8.5.2 Hello Command
      • 3.8.5.3 Query Command
      • 3.8.5.4 Update Command
      • 3.8.5.5 Status Command
      • 3.8.5.6 Remote Command
    • 3.8.6 Examples of RS232 Programs
      • 3.8.6.1 Program Without Checksum
      • 3.8.6.2 Program With Checksum
      • 3.8.6.3 Example of SEMI II Program
    • 3.8.7 Example of IEEE488 Program
  • 3.9 Co-Deposition (Two Unit Interconnection)
• Chapter 4 Programming System Operation Details
  • 4.1 State and Measurement System Sequencing
  • 4.2 State Descriptions and Parameter Limits
  • 4.3 Alarms and Stops
    • 4.3.1 Alarms
    • 4.3.2 Stops
  • 4.4 Recovering From "STOPS"
  • 4.5 Tuning the Control Loop
    • 4.5.1 Tuning a Fast Source
    • 4.5.2 Tuning a Slow Source
    • 4.5.3 Setting Maximum Power
  • 4.6 Setting S&Q Parameters (Soft Crystal Failures)
    • 4.6.1 Q-Factor (Quality)
    • 4.6.2 S-Factor (Stability)
    • 4.6.3 Determining Q and S Values
  • 4.7 Rate Ramps
    • 4.7.1 Rate Ramp to Zero Rate
  • 4.8 Use of the Hand Controller (Option)
  • 4.9 Setting the Soak and Idle Power Levels
    • 4.9.1 Setting Soak Power 1 Parameters
    • 4.9.2 Setting Soak Power 2 Parameters
    • 4.9.3 Setting Idle Power Parameters
  • 4.10 Implementing RateWatcher
  • 4.11 Crystal Fail
  • 4.12 Completing on TIME-POWER
  • 4.13 Crystal Fail Inhibit
  • 4.14 Shutter Delay
  • 4.15 Crystal Switch Details
    • 4.15.1 Sensor Shutter / CrystalSwitch Output
  • 4.16 Start Layer Without Backup Crystal Configuration
  • 4.17 Crystal Life and Starting Frequency
• Chapter 5 Calibration and Measurement
  • 5.1 Importance of Density, Tooling and Zratio
  • 5.2 Determining Density
  • 5.3 Determining Tooling
  • 5.4 Laboratory Determination of Zratio
  • 5.5 Measurement Theory
    • 5.5.1 Basics
    • 5.5.2 Monitor Crystals
    • 5.5.3 Period Measurement Technique
    • 5.5.4 Z-Match Technique
    • 5.5.5 Active Oscillator
    • 5.5.6 ModeLock Oscillator
  • 5.6 Control Loop Theory
• Chapter 6 Adjustments and Problems
  • 6.1 LCD Contrast Adjustment (XTC/2 only)
  • 6.2 Error Messages
    • 6.2.1 Powerup Errors
    • 6.2.2 Parameter Update Errors
    • 6.2.3 Other Errors
  • 6.3 Troubleshooting Guide
    • 6.3.1 Major Instrument Components, Assemblies and Mating Connectors
    • 6.3.2 Troubleshooting the Instrument
    • 6.3.3 Troubleshooting Transducers/Sensors
    • 6.3.4 Troubleshooting Computer Communications
    • 6.3.5 Leaf Spring Concerns
  • 6.4 Replacing the Crystal
    • 6.4.1 Standard and Compact
    • 6.4.2 Shuttered and Dual Sensors
    • 6.4.3 Bakeable Sensor
    • 6.4.4 Sputtering Sensor
    • 6.4.5 Crystal Snatcher
    • 6.4.6 CrystalSix
  • 6.5 Crystal Sensor Emulator IPN 760-601-G1 or 760-601-G2
    • 6.5.1 Diagnostic Procedures
      • 6.5.1.1 Measurement System Diagnostic Procedure
      • 6.5.1.2 Feed-Through Or In-Vacuum Cable Diagnostic Procedure
      • 6.5.1.3 Sensor Head Or Monitor Crystal Diagnostic Procedure
      • 6.5.1.4 System Diagnostics Pass But Crystal Fail Message Remains
    • 6.5.2 % XTAL Life
    • 6.5.3 Sensor Cover Connection
      • 6.5.3.1 Compatible Sensor Heads
      • 6.5.3.2 Incompatible Sensor Heads
    • 6.5.4 Specifications
• Appendix A Table of Densities and Z-ratios
• Index