Ddr2 dimm write operation, Chapter 7: ml561 hardware-simulation correlation – Xilinx Virtex-5 FPGA ML561 User Manual

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Virtex-5 FPGA ML561 User Guide

UG199 (v1.2.1) June 15, 2009

Chapter 7: ML561 Hardware-Simulation Correlation

R

DDR2 DIMM Write Operation

This subsection shows the test results for the DDR2_DIMM_DQ_BY2_B3 signal from
FPGA2 (U5) to the DDR2 DIMM (XP2) measured at 333 MHz (667 Mb/s), where the unit
interval (UI) = 1.5 ns.

The IBIS schematics for DDR2 DIMM interface is extracted from a multi-board project
definition of the two-board combination, which includes the ML561 motherboard and the
DDR2 DIMM at the XP2 connector of the motherboard. The impedance characteristics of
the Molex socket pin (XP2, pin 31) is also included in the IBIS model as a (TL13,
R_00179_CONN_0001, TL14) combination.

The ML561 board under test (S/N 103) is assembled with DDR2 sockets XP3, XP4, and
XP5, which can be utilized for deep DIMM interfaces as described in

Table 3-2, page 19

and

Figure 3-2, page 20

. To accurately represent the IBIS model of the

DDR2_DIMM_DQ_BY2_B3 signal, the IBIS schematics in

Figure 7-21

have added stubs for

the three socket pins at the XP3, XP4, and XP5 connectors.

The DDR2 DIMM used for this correlation testing is a single-rank DIMM part (Micron part
number MT9HTF6472xx-667). Thus for hardware measurements closest to the load, a
probe point via on the DIMM for pin U3.J1 is available.

Figure 7-21:

Post-Layout IBIS Schematics of DDR2 DIMM Write Data Bit (DDR2_DIMM_DQ_BY2_B3)

MT47H64M8CB_C...
DQ6

59.8 ohms
3.590 ps
0.022 in
MDQ19_B01

59.8 ohms
31.503 ps
0.195 in
MDQ19_B01

59.8 ohms
78.962 ps
0.490 in
MDQ19_B01

59.8 ohms
10.373 ps
0.064 in
DQ19_B01

49.8 ohms
94.605 ps
0.606 in
DDR2_DIMM_DQ_...

49.8 ohms
90.955 ps
0.582 in
DDR2_DIMM_DQ_...

49.8 ohms
90.340 ps
0.578 in
DDR2_DIMM_DQ_...

49.8 ohms
864.365 ps
5.533 in
DDR2_DIMM_DQ_...

28.5 ohms
4.473 ps
0.028 in
DDR2_DIMM_DQ_...

49.1 ohms
41.316 ps
0.264 in
DDR2_DIMM_DQ_...

49.1 ohms
78.216 ps
0.501 in
DDR2_DIMM_DQ_...

DDR2_DI...

U5_B00.H29

UG199_c7_21_071907

XP5_B00.31

XP4_B00.31

XP3_B00.31

XP2_B00.31

DDR2_DI...

DDR2_DI...

DDR2_DI...

59.1 ohms
12.486 ps
AutoPadstk_12_B...

50.3 ohms
23.650 ps
DQ19_B...

50.3 ohms
23.650 ps
DDR2_D...

50.3 ohms
23.650 ps
DDR2_D...

50.3 ohms
23.650 ps
DDR2_D...

50.3 ohms
23.650 ps
DDR2_D...

50.3 ohms
23.650 ps
DQ19_B...

50.3 ohms
23.650 ps
DQ19_B...

50.3 ohms
23.650 ps
DQ19_B...

71.6 ohms
22.319 ps
AutoPadstk_3_B00

TL1

TL5

TL11

TL12

22.0 ohms

C13

500.0 fF

17.3 fF

MDQ19_...

0.0 milliohms

0.0 milliohms

0.0 milliohms

0.0 milliohms

RN6_B01

R_00179...

R7

R5

R6

TL15

TL16

TL17

TL18

TL24

TL25

TL23

TL27

TL14

????

????

????

????

TL22

TL26

TL13

TL3

TL6

TL7

TL20

TL19

U3_B01.J1

J1_B01.31

????

500.0 fF

C8

96.3 fF

46.4 fF

253.0 fF

22.9 fF

Virtex-5 FPGA
DDR2_DQ_BY2_B3

Table 7-6:

Circuit Elements of DDR2 DIMM Write Data Bit

(DDR2_DIMM_DQ_BY2_B3)

Element

Designation

Description

Driver

U5.H29

FPGA SSTL18_II_DCI_O

Receiver XP2-U3.J1

DDR2 DIMM, 75

Ω ODT

Probe Point

C13

Via under memory on DIMM

PCB Termination

None

ODT at load

Trace Length

Multiple TLs

8.975 inches

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