Table 2-3. signal descriptions, Continued) – Texas Instruments Digital Signal Processor SM320F2812-HT User Manual
Page 21
SGUS062B
–
JUNE 2009
–
REVISED JUNE 2011
Table 2-3. Signal Descriptions
(continued)
PIN NO.
DIE PAD
DIE PAD
DIE PAD
NAME
X-CENTER
Y-CENTER
I/O/Z
(2)
PU/PD
(3)
DESCRIPTION
172-PIN
NO.
(
μ
m)
(
μ
m)
HFG
POWER SIGNALS
V
DD
22
29
2927.6
42.6
V
DD
36
43
4395.4
42.6
V
DD
55
62
5361.5
1256.0
V
DD
73
86
5361.5
3496.4
1.8-V or 1.9-V Core Digital Power Pins. See
V
DD
-
98
5361.5
4671.835
Section 6.2, Recommended Operating
V
DD
98
113
3861.3
5057.5
Conditions, for voltage requirements.
V
DD
110
125
2451.9
5057.5
V
DD
125
141
663.7
5057.5
V
DD
140
156
42.6
3845.1
V
DD
150
169
42.6
2635.3
V
SS
-
25
2517.7
42.6
V
SS
31
38
3871.3
42.6
V
SS
37
44
4490.7
42.6
V
SS
51
58
5361.5
869.2
V
SS
57
65
5361.5
1514.6
V
SS
-
79
5361.5
2818.6
V
SS
76
89
5361.5
3754.9
V
SS
84
97
5361.5
4585.7
Core and Digital I/O Ground Pins
V
SS
97
112
3956.0
5057.5
V
SS
103
118
3280.5
5057.5
V
SS
111
126
2357.2
5057.5
V
SS
-
133
1587.1
5057.5
V
SS
126
142
569.0
5057.5
V
SS
139
155
42.6
3915.2
V
SS
-
159
42.6
3580.8
V
SS
-
168
42.6
2705.4
V
DDIO
30
37
3776.0
42.6
V
DDIO
63
73
5361.5
2226.0
V
DDIO
79
92
5361.5
4051.2
3.3
–
V I/O Digital Power Pins
V
DDIO
-
105
4784.7
5057.5
V
DDIO
112
127
2262.5
5057.5
V
DDIO
142
160
42.6
3510.7
3.3
–
V Flash Core Power Pin. This pin
should be connected to 3.3 V at all times
after power-up sequence requirements
V
DD3VFL
68
78
5361.5
2732.4
have been met. This pin is used as VDDIO
in ROM parts and must be connected to
3.3 V in ROM parts as well.
Copyright
©
2009
–
2011, Texas Instruments Incorporated
Introduction
21
Product Folder Link(s):