Intel CHIPSET 820E User Manual

Page 186

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Intel

®

820E Chipset

R

186

Design

Guide

2.5 VBSY

The 2.5 V

SBY

power plane is used to power the RDRAM core and the VCMOS rail on the RDRAMs.

The RDRAM core requires an approximately 4.5-A maximum average DC current at 2.5 V. In the Intel
820E chipset reference board, the 2.5 V

SBY

plane is derived from the 5 V dual power plane using a

switching regulator. During the maximum load-step of 2 A, the maximum voltage fluctuation must be
less than 50 mV. The maximum tolerance for 2.5 V is 125 mV. However, during any 10 µs period, the
voltage cannot fluctuate more than 50 mV. The high-frequency bypassing requirements are satisfied
using capacitors on the RIMM itself. Low-frequency bypass requirements vary depending on the voltage
regulator used. By using a switching regulator with a relatively slow response time, the low-frequency
bypass recommendation is eight 100 µF bulk capacitors (0.1-

ESR) near the RIMM connectors. By

using a linear regulator with a substantially faster response time, the low-frequency bypass requirement
could be reduced.

The VCMOS rail requires a maximum of 3 mA at 1.8 V. This rail must be powered during Suspend to
RAM
. Therefore, the VCMOS rail cannot be connected to the MCH core power. Because the current
requirements of VCMOS are so low, a resistor divider can be used to generate VCMOS from 2.5 V

SBY

.

The resistor divider should be 36

(top) / 100

(bottom). Additionally, it should be bypassed with a

0.1-

µ

F chip capacitor.

The Intel reference board uses a switching regulator from 5 V dual. It may be possible to use a linear
regulator to regulate from 3.3 V

SB

. However, the thermal characteristics must be considered.

Additionally, a low-dropout linear regulator would be necessary. If 2.5 V

SBY

is regulated from 3.3 V

SB

,

the 3.3 V

SB

regulator must be able to supply enough current for all the 3.3 V

SB

device requirements as

well as the 2.5 V

SBY

requirements.

Refer to the 1.8 V power plane information for 1.8 V and 2.5 V power sequencing requirements.

Note: This regulator is required in all designs. However, in systems that do not support STR, the 2.5 V rail is

powered from either the 3.3 V or 5 V core well.

1.8 V

The 1.8 V plane powers the MCH core, the ICH2 hub interface’s I/O buffers, and the RDRAM
termination resistors. This power plane has a total power requirement of approximately 1.7 A. The 1.8 V
plane should be decoupled with a 0.1 µF and 0.01 µF chip capacitor at each corner of the MCH and with
a single 1 µF and 0.1 µF capacitor at the ICH2.

Note: This regulator is required in all designs.

Power must not be applied to the RDRAM termination resistors (V

TERM

) before applying power to the

RDRAM core (2.5 V

SBY

in this design). This can be guaranteed by placing a Schottky diode between

1.8 V and 2.5 V, as shown in the Figure 102:

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