Figure 39. agp 2.0 v, Generation and distribution, Intel – Intel CHIPSET 820E User Manual

Page 69: 820e chipset, Must be 0.4 v, However, during a 1.5 v agp 2.0 operation, v, Must be 0.5 v, This requires a flexible voltage divider for v, The flexible v, For 3.3 v add-in cards) and the source-generated v

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Intel

®

820E Chipset

R

Design Guide

69

During a 3.3 V AGP 2.0 operation, V

REF

must be 0.4 V

DDQ

. However, during a 1.5 V AGP 2.0 operation,

V

REF

must be 0.5 V

DDQ

. This requires a flexible voltage divider for V

REF

. Various methods of

accomplishing this exist, such as the example in the following figure.

Figure 39. AGP 2.0 V

REF

Generation and Distribution

AGP

device

1.5-V AGP Card

VDDQ

GND

R9

300

1%

R11

200

1%

C10

0.1 µF

VDDQ

REF

GND

GMCH

C8

500 pF

REF

U6

MOSFET

R7
1 k

+12 V

TYPEDET#

VrefCG

VrefGC

VDDQ

Notes:
1. The resistor dividers should be placed near the GMCH. The AGPREF signal must be 5 mils wide and routed 10 mils from adjacent signals.
2. R7 is the same resistor as R1 in the figure AGP VDDQ Generation Example Circuit.

R6

1 k

R5

82

R2

1 k

R4

82

C9

500 pF

(Note 2)

C8

500 pF

AGP

device

3.3-V AGP Card

VDDQ

GND

C10

0.1 uF

VDDQ

REF

GND

GMCH

R6

1 k

R2

1 k

R5

82

R4

82

REF

U6

MOSFET

+12 V

TYPEDET#

VrefCG

VrefGC

VDDQ

C9

500 pF

R9

300

1%

R7

1 k

(Note 2)

R11

200

1%

Notes:
1. The resistor dividers should be placed near the GMCH. The AGPREF signal must be 5 mils wide and routed 25 mils from adjacent signals.
2. R7 is the same resistor as R1 in the figure AGP VDDQ Generation Example Circuit.

AGP2_Vref_gen-dist

Place C10 close to MCH.

Place C10 close to MCH.

The flexible V

REF

divider shown in the preceding figure

uses an FET switch to switch between the locally

generated V

REF

(for 3.3 V add-in cards) and the source-generated V

REF

(for 1.5 V add-in cards).

Use of the source-generated V

REF

at the receiver is optional and is a product implementation issue

beyond the scope of this document.

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